IC Chip Mounting Nozzle Suction Verification
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Solution Overview
Problem
The existing methods of sucking and placing IC chips in the IC chip mounting process have a risk of contaminating the base material and/or the IC chip mounting apparatus when the chip is not successfully sucked, leading to potential scattering of adhesive on the antenna, which can contaminate both the base material and the apparatus.
Innovation Solution
An IC chip mounting apparatus equipped with an ejection unit for adhesive application, a nozzle for sucking and placing IC chips, a determination unit to verify chip suction, and a moving mechanism to retract the nozzle if the chip is not sucked, preventing adhesive scattering and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If the nozzle sucks and places IC chips using air pressure, then the IC chip mounting process can be automated, but contamination occurs when the chip is not successfully sucked
Solution Approach 1:
The determination unit checks whether the IC chip has been successfully sucked by the nozzle before the air pressure is applied to release the chip. This preliminary verification prevents the harmful action (air discharge that scatters adhesive) from occurring when the chip is not properly held, thereby preventing contamination while maintaining automation.
Solution Approach 2:
The system uses a determination unit to detect whether the IC chip has been successfully sucked by the nozzle. Based on this feedback information, the air pressure application is conditionally controlled - only applied when successful suction is confirmed. This feedback mechanism prevents contamination by avoiding unnecessary air discharge that would scatter adhesive when suction fails.
2Ease of operation
If air pressure is applied to release the IC chip from the nozzle, then the chip can be placed on the adhesive, but the adhesive may scatter and contaminate the base material and apparatus when the chip was not successfully sucked
Solution Approach 1:
The determination unit performs a preliminary check to verify successful chip suction before the air pressure is applied for chip release. This preliminary verification ensures that the chip release operation (applying air pressure) only occurs when the chip is properly held by the nozzle, preventing adhesive scattering and contamination while maintaining ease of operation.
Solution Approach 2:
The system implements feedback control where the determination unit monitors whether the IC chip has been successfully sucked. This feedback information controls the subsequent air pressure application - air pressure is only applied when successful suction is detected. This prevents the harmful effect of adhesive scattering by conditionally enabling the chip release operation based on successful chip acquisition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents contamination of the base material and the IC chip mounting apparatus by ensuring accurate placement and handling of IC chips, maintaining cleanliness and efficiency in the inlay manufacturing process.
Implementation Method 1
a nozzle movable between a first position and a second position, the nozzle being configured to suck an IC chip, when located at the first position
Implementation Method 2
an ejection unit configured to eject an adhesive toward a reference position of each antenna
Data Source
AI summary
The present invention is an IC chip mounting apparatus including: an ejection unit configured to eject an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; a nozzle movable between a first position and a second position, the nozzle being configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of each antenna, when located at the second position; a determination unit configured to determine whether an IC chip is sucked by the nozzle while the nozzle is moved from the first position to the second position; and a moving machine configured to move the nozzle away from the second position when it is determined by the determination unit that an IC chip is not sucked by the nozzle.