IC Chip Mounting on Moving Antenna Sheets During UV Curing
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Solution Overview
Problem
Conventional IC chip mounting processes are hindered by the need to stop conveying components while adhesives are cured, limiting productivity gains in inlay manufacturing.
Innovation Solution
An IC chip mounting apparatus and method that enables continuous conveyance of antenna sheets by using a rotary mounter with nozzle units to accurately place IC chips on conductive paste applied to antennas, followed by simultaneous pressing and UV curing without stopping the conveyor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conveyor is stopped to cure the adhesive, then the IC chip can be properly fixed to the antenna, but the productivity is reduced
Solution Approach 1:
The patent implements continuous conveyance of the antenna sheet through the curing station by using a rotary drum structure that rotates continuously. The IC chips are placed on the antenna sheet at specific positions, and the entire sheet moves continuously through the UV irradiation curing zone without stopping, maintaining production flow while ensuring proper curing of the adhesive.
Solution Approach 2:
The patent uses a rotary drum mechanism that is dynamically rotating rather than a static conveyor system. The drum rotates at controlled speeds to allow IC chip placement at specific angular positions while maintaining continuous motion during the curing process, enabling both precision placement and continuous production.
2Productivity
If the conveyor continues moving during adhesive curing, then productivity is improved, but the IC chip positioning precision deteriorates
Solution Approach 1:
The patent applies adhesive to the antenna sheet at predetermined reference positions before the IC chips are placed. This preliminary action ensures that the adhesive is already positioned correctly on the moving sheet, so when IC chips are placed subsequently during continuous conveyance, they automatically align with the pre-marked reference positions, maintaining precision without stopping the conveyor.
Solution Approach 2:
The patent replaces traditional mechanical positioning methods (such as physical stops or fixtures that would require conveyor shutdown) with a rotary drum system that uses rotational positioning and pre-applied adhesive markers. The continuous rotation combined with pre-positioned adhesive references allows precision placement to be achieved through coordinated motion control rather than mechanical interruption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves high productivity in mounting IC chips on antennas by allowing continuous processing, enhancing the efficiency of the inlay manufacturing process.
Implementation Method 1
a light irradiator that irradiates light to the IC chip on the conductive paste while pressed to the antenna, thereby curing the conductive paste
Data Source
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AI summary
The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each antenna in the antenna continuous body; and a light irradiator configured to irradiate, with light, the adhesive of each antenna of the antenna continuous body that is conveyed by the conveyor, wherein the light irradiator is configured to irradiate the adhesive of each antenna with the light, while the IC chip on the adhesive is pressed to the antenna.