Pre-test Conditioning Station for IC Contact Oxidation Removal
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Solution Overview
Problem
Integrated circuit (IC) testing systems face premature mechanical failure due to high forces required to overcome oxidation layers on solder balls, leading to excessive wear and potential redesign costs, especially when testing multiple ICs.
Innovation Solution
A pre-test conditioning station is introduced to remove oxidation layers from IC contacts using methods like abrasion, agitation in slurry or aggregate media, polishing, dipping in de-oxidizing liquids, or spraying with de-oxidizing liquids, followed by air handling to reduce the force needed for electrical contact during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high force is applied to break oxidation layer on solder balls, then good electrical contact is achieved, but mechanical wear on testing system components increases
Solution Approach 1:
The patent applies preliminary action by introducing a pre-test conditioning station that removes oxidation layers from solder balls before the actual testing process. This preliminary cleaning action eliminates the need for high-force contact during testing, thereby protecting mechanical components from excessive wear while ensuring good electrical contact quality.
Solution Approach 2:
The patent extracts the oxidation layer removal function from the main testing process and places it in a separate pre-test conditioning station. This separation allows the testing system to operate with lower forces while the conditioning station handles the oxidation removal, thus resolving the contradiction between contact quality and equipment durability.
2Reliability
If high spring constant pogo pins are used to overcome oxidation layer, then electrical contact is improved, but mechanical failure of device handler and socket increases
Solution Approach 1:
The pre-test conditioning station performs oxidation layer removal before testing, allowing the use of pogo pins with lower spring constants during testing. This preliminary action protects the mechanical structure from excessive forces while maintaining electrical contact quality.
Solution Approach 2:
The patent changes the state of the solder ball surface by removing oxidation layers through conditioning processes (abrasion, chemical treatment, or mechanical agitation). This parameter change in surface condition allows for lower contact forces during testing, thereby reducing mechanical stress on the device handler and socket components.
3Productivity
If multiple ICs are tested with high force to overcome oxidation, then testing productivity is maintained, but equipment wear is multiplied and redesign costs increase
Solution Approach 1:
The pre-test conditioning station is integrated into the testing system workflow to remove oxidation layers before each IC is tested. This preliminary action ensures that subsequent testing can be performed with lower forces, preventing cumulative wear on equipment when testing multiple ICs and avoiding expensive redesigns.
Solution Approach 2:
The patent replaces the mechanical force-based oxidation removal method with alternative conditioning methods such as abrasion, chemical treatment, or mechanical agitation in a controlled environment. This substitution allows for effective oxidation removal without requiring high contact forces during actual testing, thereby protecting equipment during high-volume production testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable electrical contact with reduced pressure on testing system components, extending equipment lifespan and reducing design and maintenance costs by minimizing wear and oxidation-related issues.
Implementation Method 1
The pre-test conditioning station removes at least a portion of the oxidation layer via at least one of abrasion, agitation in a slurry or aggregate media, polishing
Implementation Method 2
agitation in a slurry or aggregate media
Implementation Method 3
polishing
Implementation Method 4
dipping in a de-oxidizing liquid bath, or spraying with a de-oxidizing liquid
Implementation Method 5
The pre-test conditioning station includes an air handling system to provide a flow of air to remove particulate residue
Data Source
AI summary
Methods and apparatus for testing packaged ICs are disclosed. In some embodiments, an apparatus for testing a packaged integrated circuit (IC) can include a device handler for moving the packaged IC; a testing station for testing the packaged IC; and a pre-test conditioning station configured to remove at least a portion of an oxidation layer formed on contacts of the packaged IC prior to testing. In some embodiments, a method for testing packaged ICs may include providing a packaged IC to be tested; at least partially removing an oxidation layer from contacts of the packaged IC prior to testing; inserting the packaged IC into an interface structure; and testing the packaged IC.