IC Cooling Package Structure With 3D Thermal Die Enclosure
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Solution Overview
Problem
Existing cooling solutions for integrated circuits, such as graphical processing unit chips, are limited by the small surface area contacting the cooler, restricted heat conduction through thermal interface materials, and limited improvements from shape changes or fan enhancements.
Innovation Solution
A cooling package structure that surrounds the circuit die with a thermal conductive material filling gaps between the die and enclosure walls, contacting multiple surfaces for enhanced heat dissipation, using a high thermal conductivity material that solidifies to form a seamless enclosure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal conductive material is smeared between GPU and cooler, then heat conduction is improved, but the surface area contacting the cooler remains limited
Solution Approach 1:
The patent transitions from two-dimensional surface contact (top surface only) to three-dimensional volumetric contact by filling the entire enclosure space around the die with thermal conductive material, enabling heat conduction through multiple surfaces including top, bottom, and sidewalls
Solution Approach 2:
The thermal conductive material is applied in a molded or cast configuration that fills the enclosure volume, creating extensive contact surfaces throughout the three-dimensional space rather than relying on limited planar interfaces
2Temperature
If traditional cooler shapes are used, then manufacturing is simple, but cooling performance is limited
Solution Approach 1:
The cooler is divided into multiple functional segments: an enclosure portion that defines the thermal conduction volume, a heat sink portion with optimized fin structures, and integrated mounting features, allowing each segment to be optimized independently for its specific function
Solution Approach 2:
The cooler combines materials with different properties - the enclosure and heat sink use high thermal conductivity materials (such as aluminum or copper alloys), while the thermal conductive material filling the enclosure provides additional thermal pathways, creating a composite thermal management system
3Ease of manufacture
If air gaps are present between die and package surface, then assembly is easier, but heat conduction is hindered
Solution Approach 1:
The thermal conductive material is pre-applied to the package substrate before die attachment, ensuring that when the die is mounted, the gaps are automatically filled with thermally conductive material, eliminating the need for post-assembly gap filling operations
Solution Approach 2:
The thermal conductive material acts as an intermediary substance that fills the gaps between the die and package substrate, providing a continuous thermal pathway that bridges the air gaps while maintaining ease of assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency by up to 90% compared to traditional solutions, allowing higher performance circuit dies and reduced fan noise, and supports higher power consumption without performance bottlenecks.
Implementation Method 1
The thermal conductive material is located in the first gap and in the second gap such that the thermal conductive material contacts the first package surface of the package substrate, the inner sidewalls of the enclosure and the first die surface and the sidewall surfaces of the circuit die
Data Source
AI summary
A cooling package for an integrated circuit, including: package substrate of the integrated circuit having a first package surface, an enclosure and a thermal conductive material filling a gap between the substrate and a circuit die locatable therein and filling a gap between interior sidewalls of the enclosure and sidewall surfaces of the circuit die couplable to the first package surface. A method including: mounting an enclosure to the first package surface, the enclosure surrounding a location on the first package surface the circuit die is couplable thereto and the circuit die is locatable therein, and, filling the enclosure with the thermal conductive material such that the gaps are filled with the thermal conductive material. An integrated circuit cooling package including the substrate, first and second enclosures and first and second thermal conductive materials is also disclosed.