IC Cover with Bent Attachment for FPCB Grounding

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Solution Overview

Problem

The existing display devices face challenges in preventing electro-static discharge (ESD) due to the stepped structure of the open area on the flexible printed circuit board (FPCB), which can lead to incomplete contact between the IC cover and the FPCB, necessitating additional conductive tape that increases costs.

Innovation Solution

A display device design featuring an IC cover with a cut portion that includes bent attachment pieces and an adhesive resin, which contacts the open ground portion of the FPCB, ensuring effective grounding without the need for additional conductive tape, by creating a slit or opening that exposes the open ground portion and adapts to the position of the attachment pieces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the open area of the FPCB is made narrow to reduce size, then the device compactness is improved, but the contact reliability between the IC cover and FPCB deteriorates

Engineering Contradiction:
Improvedevice compactnessVSAvoidcontact reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The IC cover is designed with a bent attachment piece that can dynamically adapt to the stepped structure of the FPCB open area. The bending portion allows the attachment piece to flex and make reliable contact with the FPCB surface even when the open area is narrow, thus maintaining contact reliability while enabling compact device design.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The attachment piece incorporates a bent portion that changes its geometric parameters (curvature, angle) to match the stepped structure of the FPCB. This parameter adaptation allows the IC cover to maintain reliable electrical contact with the FPCB ground area regardless of the open area width, resolving the contradiction between compactness and contact reliability.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If additional conductive tape is added to ensure complete contact, then the contact reliability is improved, but the manufacturing cost increases

Engineering Contradiction:
Improvecontact reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The IC cover structure itself provides the grounding function through its bent attachment piece that directly contacts the FPCB open area. This self-service design eliminates the need for separate conductive tape components, maintaining contact reliability while reducing manufacturing complexity and cost.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The IC cover serves multiple functions: it protects the IC and simultaneously provides the grounding connection through its bent attachment piece. By integrating the grounding function into the IC cover structure itself, the design eliminates the need for additional conductive tape, reducing manufacturing cost while maintaining contact reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If the IC cover is designed to contact the FPCB open area directly, then the device complexity is reduced, but the contact stability deteriorates due to the stepped structure

Engineering Contradiction:
Improvedevice complexityVSAvoidcontact stability
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The bent attachment piece provides dynamic adaptability to the stepped structure of the FPCB. The bending portion allows the attachment piece to flex and conform to the stepped geometry, ensuring stable electrical contact without requiring complex additional structures or components.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively prevents ESD without the need for additional conductive tape, improving contact efficiency and reducing manufacturing costs, even when the open area of the FPCB is narrow, by ensuring reliable attachment of the IC cover to the FPCB.

Implementation Method 1

an adhesive resin between at least one of the attachment pieces and the open ground portion

Methodology Applied
Scientific EffectAdhesive: Adhesive

Data Source

PatentUS10993311B2Display device
Publication Date: 2021.04.27 SAMSUNG DISPLAY CO LTD
  • US10993311B2 patent drawing
  • US10993311B2 patent drawing
  • US10993311B2 patent drawing

AI summary

A display device is capable of preventing electro-static discharge by attaching a driving integrated circuit cover to a driving integrated circuit and a flexible printed circuit board, the display device including a display panel including a display area and a non-display area, a driving integrated circuit for providing signals, data, and voltages to the display area, a flexible printed circuit board coupled to the driving integrated circuit, and including an open ground portion at one side of the flexible printed circuit board, and an integrated circuit cover portion overlapping the driving integrated circuit and at least a portion of the flexible printed circuit board, and including a cut portion at an area corresponding to the open ground portion.