Integrated Circuit Cover as Component Substrate

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Solution Overview

Problem

Existing integrated circuits are large due to the presence of additional electronic components on the surface, which increases size and manufacturing costs, and are sensitive to noise from external connections.

Innovation Solution

An integrated circuit design where the additional electronic component is manufactured on the cover, which serves as both a hermetic seal and a substrate, reducing chip size, manufacturing costs, and noise sensitivity by using the cover's outside surface for component placement and direct wire connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If additional electronic components are placed on the surface of the integrated circuit chip, then the functionality and performance of the circuit are improved, but the size of the integrated circuit increases

Engineering Contradiction:

ImprovefunctionalityVSAvoidchip size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent moves additional electronic components from the two-dimensional chip surface to the three-dimensional cover structure. The cover serves as a substrate for mounting components such as coils, capacitors, and resistors, effectively utilizing the vertical dimension and external surfaces to accommodate components that would otherwise require valuable chip real estate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cover is designed to perform multiple functions simultaneously: it provides hermetic sealing for the cavity, serves as a mechanical support structure, and acts as a substrate for mounting additional electronic components. This multi-functionality eliminates the need for separate structures for each purpose, thereby reducing overall device size.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If additional electronic components are placed on the surface of the integrated circuit chip, then the circuit functionality is enhanced, but the manufacturing cost increases

Engineering Contradiction:

Improvecircuit functionalityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines the hermetic seal cover and the component mounting substrate into a single integrated structure. By forming the cover with integrated circuit board features directly during the same manufacturing process, the patent eliminates separate assembly steps for mounting components, thereby reducing manufacturing complexity and cost.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The cover structure is prepared in advance with integrated circuit board features (such as mounting holes, conductive traces, and pad structures) formed during the cover manufacturing process itself. This preliminary preparation of mounting infrastructure simplifies subsequent component attachment and reduces overall manufacturing steps.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If additional electronic components are connected through external wires, then the circuit connectivity is achieved, but the noise sensitivity of the circuit increases

Engineering Contradiction:

Improvecircuit connectivityVSAvoidnoise sensitivity

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The cover structure serves as an intermediary substrate that provides controlled impedance pathways and shielding for signal connections between components. By routing signals through the cover's integrated conductive structures rather than external wires, the patent reduces electromagnetic interference and noise pickup while maintaining electrical connectivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Reliability

If the cover is used only for hermetic sealing, then the sealing function is optimized, but the overall device size increases due to separate component mounting areas

Engineering Contradiction:

Improvehermetic sealingVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The hermetic seal cover is designed to simultaneously serve as the substrate for mounting additional electronic components. By integrating the component mounting function into the cover structure itself, the patent eliminates the need for separate mounting areas or additional packaging layers, thereby maintaining compact device dimensions while preserving hermetic sealing integrity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS7961478B2Integrated circuit, and a mobile phone having the integrated circuit

Publication Date: 2011.06.14 NXP BV

AI summary

In an example embodiment, an integrated circuit comprises an on-chip electronic component. The on-chip electronic component has an active surface in a hermetically sealed cavity and a cover to hermetically seal the cavity. There is an additional electronic component wherein the additional electronic component is fixed on the cover.