IC Package Cover Openings for Uniform Glue Sealing
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Solution Overview
Problem
Existing integrated circuit package covers face challenges in achieving uniform gluing and preventing glue bleed, leading to potential damage to the chip and increased package dimensions.
Innovation Solution
A metallic cover with peripheral through openings, an elongated shape parallel to its edges, and a peripheral frame coupled to a central plate, allows for easier glue deposition and absorption, ensuring a tight seal and reducing pressure on the chip during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cover is used for an integrated circuit package, then the chip is protected, but glue bleed and non-uniform gluing occur leading to potential chip damage
Solution Approach 1:
The cover incorporates through-openings that function as porous structures, allowing excess glue to escape during the gluing process. This prevents glue accumulation and bleed while ensuring uniform glue distribution across the cover-substrate interface, thereby protecting the chip from damage caused by non-uniform gluing.
Solution Approach 2:
The through-openings extract excess glue from the gluing interface, removing the harmful factor of glue accumulation. By providing escape paths for excess glue, the openings prevent glue bleed and ensure that only the necessary amount of glue remains to create a uniform bond between the cover and substrate.
2Ease of manufacture
If traditional covers are used, then manufacturing is simple, but glue deposition is difficult and results in non-uniform gluing
Solution Approach 1:
The through-openings create a porous structure in the cover that facilitates uniform glue distribution. As glue is deposited, it flows through the openings uniformly, ensuring consistent gluing across the entire cover-substrate interface without requiring complex deposition control mechanisms.
Solution Approach 2:
The cover features localized through-openings strategically positioned to control glue flow in different regions. This local modification of the cover structure enables precise control over glue deposition patterns, ensuring uniform gluing while maintaining overall manufacturing simplicity.
3Reliability
If a tight seal is achieved, then package integrity is improved, but pressure on the chip increases during assembly
Solution Approach 1:
The through-openings extract excess glue and air from the sealing interface during assembly, preventing pressure buildup. This allows the cover and substrate to form a tight seal for package integrity while the openings continuously relieve pressure that would otherwise be transmitted to the chip.
Solution Approach 2:
The through-openings are pre-formed in the cover structure, enabling pressure relief to occur automatically during the gluing and sealing process. This preliminary structural feature ensures that pressure management is built into the assembly process itself, protecting the chip without requiring additional pressure control mechanisms.
Data Source
AI summary
A cover for an integrated circuit package includes a central plate and a peripheral frame surrounding the central plate. The peripheral frame is vertically spaced from and parallel to the central plate. The peripheral frame includes through openings formed therein. The cover can be used to package a semiconductor chip that is mounted to a substrate.