Integrated Circuit Defect Prediction Using Care Areas
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Solution Overview
Problem
Conventional high-throughput inspection systems lack the resolution to detect defects in integrated circuits, while high-resolution systems like e-beam systems have low throughput, making them unsuitable for inline defect inspection due to time-consuming scanning processes.
Innovation Solution
Generating 'care areas' suspected of defects using full-chip lithography simulations and defect prediction techniques, allowing high-resolution inspection systems to focus on specific areas, thereby increasing throughput and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional high-throughput inspection systems are used, then productivity is improved, but measurement precision deteriorates
Solution Approach 1:
The patent applies local quality by directing high-resolution inspection resources selectively to specific 'care areas' on the wafer where defects are most likely to occur, rather than uniformly inspecting the entire wafer surface. This allows the system to maintain high measurement precision in critical regions while preserving overall productivity.
Solution Approach 2:
The patent segments the wafer inspection task by dividing it into multiple care areas based on process condition data and defect prediction algorithms. Each care area is then inspected independently with appropriate resolution, allowing the system to optimize the balance between throughput and precision for different regions.
2Measurement precision
If high-resolution inspection systems like e-beam systems are used, then measurement precision is improved, but productivity deteriorates
Solution Approach 1:
The patent extracts only the critical care areas from the full wafer that require high-resolution inspection. By using defect prediction techniques to identify these specific regions beforehand, the system eliminates the need to scan entire wafers with low-throughput high-resolution systems, thereby maintaining measurement precision where needed while dramatically improving overall productivity.
Solution Approach 2:
The patent performs preliminary defect prediction and care area identification using process condition data before the actual inspection takes place. This preliminary action allows high-resolution systems to focus only on predicted defect-prone areas, avoiding the time-consuming full-wafer scanning that would otherwise be required.
3Measurement precision
If full wafer scanning is performed with high-resolution systems, then measurement precision is improved, but loss of time increases
Solution Approach 1:
The patent changes the parameter of inspection area from 'full wafer' to 'predicted care areas' based on process condition analysis. By dynamically adjusting which regions require high-resolution inspection according to real-time process data, the system maintains measurement precision while minimizing inspection time through targeted rather than comprehensive scanning.
Data Source
AI summary
Methods and systems for defect prediction are provided. The method includes receiving feature data of an integrated circuit (IC) and process condition data of a production process associated with the IC, and determining a care area associated with the IC using the feature data, the process condition data, and a defect prediction technique, wherein the care area includes a potential defect and is inspected by a high-resolution inspection system. Based on the provided methods and systems, care areas can be generated incorporating actual process conditions when the inspected IC is being manufactured, and fast and high-resolution IC defect inspection systems can be implemented.