IC Functional Component Configuration for Defect Rerouting
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Solution Overview
Problem
Integrated circuit manufacturing faces challenges in achieving high yields and efficient functionality due to defective components, leading to waste and limited performance, as traditional methods either disable functionality or result in surplus unused components.
Innovation Solution
A system and method that dynamically configures operational characteristics of functional components within integrated circuits based on manufacturing defects, performance requirements, and system health, enabling the salvage of defective components by disabling them and rerouting workflow to functional ones, thus maintaining basic functionality and increasing wafer yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional manufacturing methods are used to ensure high reliability with no defective components, then reliability is improved, but manufacturing cost and resource consumption increase significantly
Solution Approach 1:
The system segments the functional components into individual addressable units, allowing selective disabling of defective components while maintaining functionality of good components. This segmentation enables precise control over component states, resolving the contradiction by allowing manufacturing of circuits with potential defects while ensuring reliability through post-manufacturing configuration.
Solution Approach 2:
The system changes the operational state parameter of functional components dynamically. By transitioning components between enabled and disabled states based on their operational status, the system maintains reliability without requiring perfect manufacturing, thus reducing manufacturing complexity and resource consumption.
2Reliability
If surplus components are fabricated to replace defective ones, then reliability is improved, but waste of die area and resources increases
Solution Approach 1:
The system extracts and removes defective components from the functional circuit by disabling them, while keeping the physical space occupied by these components available for potential future use or simply non-interfering. This eliminates the need for surplus components, reducing die area waste while maintaining reliability through selective component removal.
Solution Approach 2:
The system discards defective components by disabling them while recovering the die area they occupy from being wasted. The disabled components no longer interfere with circuit operation, and their physical space is effectively recovered for potential alternative uses or simply does not contribute to waste, resolving the contradiction between reliability and resource efficiency.
3Reliability
If functional capability is removed when one component is defective, then reliability is improved, but productivity and performance decrease
Solution Approach 1:
The system segments the processing workload and routes it through available functional components. By dividing the workflow and distributing it across multiple operational components rather than removing entire functional capabilities, the system maintains both reliability (by excluding defective components) and productivity (by utilizing all working components).
Solution Approach 2:
The system implements universal routing capability that can direct workflow to any available functional component regardless of which specific component is defective. This multi-functional routing approach ensures that the circuit maintains full productivity by utilizing all operational components, while reliability is preserved by excluding defective ones from the workflow.
4Adaptability or versatility
If high performance die with large number of components are manufactured, then functionality is improved, but yield decreases significantly
Solution Approach 1:
The system introduces dynamic configurability to the circuit, allowing the functional composition to be adjusted after manufacturing based on actual component performance. This dynamic adaptation enables high-functionality circuits to be manufactured with acceptable yield, as defective components can be disabled and workflow rerouted in real-time, transforming static high-risk manufacturing into a dynamic resilient system.
Solution Approach 2:
The system changes the operational parameters of components post-manufacturing, transitioning from a static fixed-functionality model to a dynamic adaptable model. By changing the enabled/disabled state of components based on their actual performance, the system achieves high functionality with improved yield, as circuits can tolerate manufacturing variations that would previously have resulted in complete failure.
Data Source
AI summary
The present invention systems and methods enable configuration of functional components in integrated circuits. A present invention system and method can flexibly change the operational characteristics of functional components in an integrated circuit die based upon a variety of factors, including if the die has a defective component. An indication of the defective functional component identification is received. A determination is made if the defective functional component is one of a plurality of similar functional components that can provide the same functionality. The other similar components can be examined to determine if they are parallel components to the defective functional component. The defective functional component is disabled if it is one of the plurality of similar functional components and another component can handle the workflow that would otherwise be assigned to the defective component. Workflow is diverted from the disabled component to other similar functional components.