IC Diagonal Mounting for Straight Signal Paths
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Solution Overview
Problem
Existing integrated circuits for optical transceiver modules face challenges in fitting into standard dimensions due to non-straight and mismatched signal paths, and bond wires that are not optimized for high-speed data transmission.
Innovation Solution
The integrated circuit is designed with inputs and outputs located on opposite edges, allowing diagonal mounting in the transceiver module, which enables straight signal paths and the use of shorter, more evenly matched bond wires by positioning connections in central regions of the edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional integrated circuit packages are used in optical transceiver modules, then the circuit can be manufactured with standard packaging processes, but the signal paths become non-straight and mismatched in length, degrading high-speed data transmission performance
Solution Approach 1:
The integrated circuit package is designed with an asymmetric layout where the input and output pads are positioned on opposite edges of the package. This asymmetric arrangement allows the package to be mounted at a 45-degree angle in the transceiver module, transforming the signal paths into straight lines that connect efficiently to the optical components while maintaining compatibility with standard packaging manufacturing processes
2Adaptability or versatility
If the integrated circuit is mounted to accommodate standard package dimensions, then the package fits within the transceiver module, but the bond wires connecting pads to package landings become long and mismatched in length
Solution Approach 1:
The invention changes the mounting orientation from the conventional 0-degree alignment to a 45-degree angle, utilizing an additional dimensional degree of freedom. This angular transformation allows the bond wires to connect pads to package landings along diagonal paths that are both shorter and more evenly matched in length, while still fitting within the standard transceiver module dimensions
3Reliability
If straight signal paths are implemented for high-speed data transmission, then signal integrity is improved, but the integrated circuit package cannot be conveniently fitted into standard transceiver module dimensions
Solution Approach 1:
The asymmetric pad placement on opposite edges of the package enables a 45-degree mounting configuration that achieves straight signal paths from the integrated circuit to the optical components. This asymmetric design resolves the conflict between signal integrity and ease of installation by allowing the package to fit within standard dimensions while maintaining optimal straight signal paths for high-speed data transmission
Data Source
AI summary
An integrated circuit product, for bidirectional communication, has two inputs and two outputs. The first input is located on a first edge of the integrated circuit product. The first output is located on a second edge of the integrated circuit product, the second edge being located adjacent to the first edge. The second input is located on a third edge of the integrated circuit product, the third edge being opposite the first edge. The second output is located on a fourth edge of the integrated circuit product, the fourth edge being opposite the second edge. The integrated circuit product can be mounted diagonally in a transceiver module, allowing straight signals paths from the inputs and outputs of the integrated circuit product to the corresponding inputs and outputs of the transceiver module. The inputs and outputs of the integrated circuit product can be located in the respective centre regions of their respective edges, so that connection pads of the integrated circuit within the integrated circuit product can be connected to the package landings of the integrated circuit product by means of the shortest available bond wires.