IC Dice Binning by Defect Sets for Yield Improvement
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Solution Overview
Problem
The challenge in the production of integrated circuit (IC) products is the high discarding of IC dice due to defects, leading to increased manufacturing costs and resource wastage, as existing methods require defect-free dice for packaging, resulting in poor yield and reduced profitability.
Innovation Solution
A method where IC dice are manufactured from a common specification, tested for defective circuitry, and assigned to bins based on defect sets, allowing for the selection of dice with specific defect sets to match product definitions, enabling the creation of packages with varying levels of functionality without incurring new development costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If defect-free IC dice are required for packaging, then product reliability is improved, but manufacturing yield deteriorates due to high discarding of defective dice
Solution Approach 1:
The patent applies local quality by creating different product versions from the same IC die based on which specific circuit elements are defective. Instead of discarding entire dice with any defects, the system identifies defective regions and creates product definitions that exclude those regions while utilizing functional areas. This allows partial-use of defective dice to maintain reliability in used circuits while improving overall yield by reducing waste.
Solution Approach 2:
The patent changes the parameter of product functionality by creating multiple product definitions from a single IC die specification. By varying the set of functional circuit elements included in each product definition based on defect patterns, the system can produce different product versions (full-function, reduced-function) from the same physical die, thereby improving yield without compromising the reliability of the delivered product.
2Adaptability or versatility
If different product versions are created from the same IC die, then adaptability is improved, but device complexity deteriorates due to multiple product definitions
Solution Approach 1:
The patent applies universality by creating a unified defect-set-based classification system that serves multiple purposes: it identifies defective circuits, groups dice into bins, generates product definitions, and guides packaging decisions. This single defect set data structure enables the same IC die to be adapted to multiple product versions, achieving versatility without proportionally increasing complexity.
Solution Approach 2:
The patent manages complexity by parameterizing product definitions based on defect sets. Instead of hardcoding multiple product configurations, the system dynamically generates product definitions by excluding defective circuit elements identified through testing. This parameter-driven approach allows flexible product adaptation while keeping the underlying system relatively simple.
3Manufacturing precision
If IC dice are binned by defect sets, then manufacturing precision is improved, but measurement precision deteriorates due to difficulty in detecting and categorizing defects
Solution Approach 1:
The patent applies segmentation by dividing the defect classification process into distinct stages: initial defect detection through testing, grouping into equivalence classes (bins) based on defect patterns, and subsequent product definition generation. This segmented approach allows sophisticated classification without requiring all defects to be perfectly detected and characterized at once, improving manufacturing precision while managing measurement complexity.
Data Source
AI summary
In the disclosed methods, integrated circuit (IC) dice are manufactured from a common specification, and the IC dice are tested for defective circuitry. Respective defect sets are generated to indicate defective circuitry in the IC die. The dice are assigned to bins based on the respective defect sets. For each bin, all IC dice assigned to the bin have equivalent respective defect sets. Product definitions are provided, and each product definition indicates a respective set of circuitry required for a corresponding product. Respective sets of packages are manufactured for each product. In the manufacturing of each package of a respective set of packages for each product, one or more IC dice are selected from a subset of the plurality of bins such that the IC dice have respective defect sets allowed by the product definition of the product. The selected IC dice are then manufactured into the package.