IC Die Alignment Features in Mask Window Apertures
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Solution Overview
Problem
Current semiconductor device packaging methods require expensive and time-consuming fabrication steps or high precision for mounting and interconnecting integrated circuit dice, lacking an economical and efficient solution.
Innovation Solution
A method involving the formation of alignment features on integrated circuit dice and a windowed substrate with corresponding apertures, allowing mechanical biasing and secure positioning of dice within the substrate, followed by filling gaps with adhesives or filler materials for reliable mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls or bumps are used for flip-chip technologies, then electrical connections between semiconductor dice and carrier substrates are improved, but fabrication cost and process complexity increase
Solution Approach 1:
The patent extracts the alignment and connection function from complex solder bump fabrication and separates it into two independent components: alignment features (formed on the die or substrate) and aperture structures (formed in the substrate or mask). This allows mechanical alignment without requiring expensive solder ball formation processes, thereby reducing fabrication complexity while maintaining reliable electrical connections through separate bond pad connections.
Solution Approach 2:
The patent segments the mounting process into distinct functional elements: alignment features (with alignment edges), apertures (with positioning edges), and bond pad connections. This segmentation allows each element to be optimized independently - alignment features provide precise positioning, apertures provide mechanical retention, and bond pads provide electrical connection - thereby reducing overall process complexity while maintaining reliability.
2Reliability
If known good dice are mounted within cavities with redistribution layers, then interconnect reliability is improved, but manufacturing time and process steps increase
Solution Approach 1:
The patent performs preliminary alignment by forming alignment features on the dice or substrate and corresponding apertures before the actual mounting process. This preliminary action establishes precise positional relationships in advance, allowing dice to be quickly and accurately placed without requiring complex real-time alignment during mounting, thereby reducing manufacturing time while maintaining interconnect reliability.
Solution Approach 2:
The patent introduces alignment features and apertures as intermediary structures that mediate between the dice and the substrate. These intermediaries provide precise mechanical alignment and positioning, enabling rapid and accurate mounting without requiring complex cavity structures or redistribution layers, thereby reducing manufacturing time while maintaining connection reliability.
3Manufacturing precision
If high precision placement is demanded for dice within substrate, then mounting accuracy is improved, but placement cost and process difficulty increase
Solution Approach 1:
The patent enables self-alignment by forming alignment features on the dice or substrate and corresponding apertures with positioning edges. When the die is placed in the aperture, the alignment edges of the alignment feature automatically engage with the positioning edges of the aperture, providing self-correcting alignment without requiring high-precision placement equipment or complex positioning procedures, thereby improving placement accuracy while simplifying the manufacturing process.
Solution Approach 2:
The patent creates an equipotential alignment system where the alignment features and apertures are designed with complementary geometries and tolerances that ensure automatic alignment regardless of minor variations in placement position. The alignment edges and positioning edges are designed to work together within a tolerance range, providing consistent alignment results across all dice without requiring ultra-precise placement, thereby improving manufacturing precision while easing the placement process.
Data Source
AI summary
A method of packaging an integrated circuit die including forming a mask window having a first aperture with a first set of alignment edges and forming an alignment feature on an uppermost surface of the integrated circuit die where the alignment feature has a second set of alignment edges. The alignment feature is inserted into the first aperture. The integrated circuit die is mechanically biased until the first and second set of alignment edges are in physical contact with one another and the alignment feature is secured into the mask window, thus forming an integrated circuit die assembly.