IC Die Processing on Dicing Sheet for Clean Surface Bonding
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Solution Overview
Problem
The challenge in microelectronic packaging is the contamination of semiconductor dies during processing, which leads to poor bonding and increased complexity and costs in stacking and bonding these dies, particularly in techniques like ZIBOND and DBI, where high cleanliness and flatness are crucial.
Innovation Solution
The proposed solution involves processing dies on a dicing sheet or device processing film, where they are cleaned, ashed, and activated in place to minimize handling and reduce contamination, followed by direct transfer to a receiving surface for bonding, using techniques such as plasma ashing and thermal treatment to enhance bonding, and employing a 'punch' method to transfer dies without contaminating the bonding surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If dies are handled and transferred multiple times during processing, then processing flexibility is improved, but contamination increases and bonding reliability deteriorates
Solution Approach 1:
The process is segmented into distinct zones on the dicing sheet: a processing zone where cleaning and plasma treatment occur, and a bonding zone where dies are transferred for stacking. This spatial segmentation allows multiple processing operations without additional handling, reducing contamination while maintaining flexibility.
Solution Approach 2:
The dicing sheet acts as an intermediary carrier that holds dies throughout the entire processing sequence. Instead of transferring dies between multiple tools, the dicing sheet serves as a stable intermediate platform that enables in-situ processing and subsequent bonding operations.
2Device complexity
If traditional handling methods are used to transfer dies, then processing steps are simplified, but die cleanliness deteriorates and particles increase
Solution Approach 1:
Cleaning, plasma ashing, and activation treatments are performed preliminarily on the dicing sheet before die transfer. This preliminary action ensures dies are clean and activated while still on the carrier, eliminating the need for separate handling steps that would introduce contamination.
Solution Approach 2:
Traditional mechanical handling (pick-and-place tools, manual transfer) is replaced with in-situ processing on the dicing sheet. The mechanical system that would physically move dies is substituted with chemical and plasma processes that occur while dies remain fixed on the carrier.
3Adaptability or versatility
If multiple handling steps are employed to process and transfer dies, then processing adaptability is improved, but manufacturing complexity and costs increase
Solution Approach 1:
The dicing sheet serves multiple functions: it acts as a carrier for die mounting, a platform for cleaning and plasma processing, and a transfer mechanism for die stacking. This multi-functionality eliminates the need for separate equipment for each operation, reducing manufacturing complexity while maintaining adaptability.
Solution Approach 2:
Multiple processing operations (die mounting, cleaning, plasma ashing, activation, and transfer) are merged into a single integrated process on the dicing sheet. This consolidation reduces the number of separate manufacturing steps and equipment needed, lowering complexity and cost.
4Device complexity
If conventional die transfer methods are used, then equipment simplicity is maintained, but bonding precision and cleanliness deteriorate
Solution Approach 1:
The dicing sheet serves as a precision intermediary that maintains die position and orientation throughout processing. It enables accurate transfer to bonding locations without requiring complex pick-and-place equipment, achieving high bonding precision through the engineered dicing sheet structure and process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexity and costs, improves die cleanliness, and enhances bonding reliability by minimizing particles and contaminants, allowing for more efficient processing of large batches with fewer handling steps and improved yield.
Implementation Method 1
cleaned, ashed, and activated in place to minimize handling and reduce contamination, followed by direct transfer to a receiving surface for bonding, using techniques such as plasma ashing
Implementation Method 2
The package can be permanently bonded in place by heating the assembly so as to melt or 'reflow' the solder or otherwise activate the bonding material
Data Source
AI summary
Representative implementations provide techniques and systems for processing integrated circuit (IC) dies. Dies being prepared for intimate surface bonding (to other dies, to substrates, to another surface, etc.) may be processed with a minimum of handling, to prevent contamination of the surfaces or the edges of the dies. The techniques include processing dies while the dies are on a dicing sheet or other device processing film or surface. Systems include integrated cleaning components arranged to perform multiple cleaning processes simultaneously.