IC Die Edge Damage Detection via Seal Ring Sensing Wire
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Solution Overview
Problem
Current methods for detecting damage, such as cracks near the edge of integrated circuit dies, rely on visual inspection and are inadequate, as they do not effectively identify damage caused by the dicing process that can lead to functional failures.
Innovation Solution
A damage detection circuit is integrated into the integrated circuit die, comprising a test logic circuit, a transmit/receive interface circuit, and a sensing conductive wire line that surrounds the seal ring, allowing for non-visual inspection by testing the continuity and conductivity of the sensing wire line to detect damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If visual inspection is used to detect damage, then the inspection process is simple, but the detection precision is insufficient to identify cracks near the seal ring
Solution Approach 1:
The patent replaces the mechanical visual inspection process with an electrical detection system. A sensing conductive wire line is integrated around the seal ring, and a detection circuit monitors its electrical properties (resistance, capacitance, or continuity) to detect cracks or damage. This substitution enables precise automated detection of damage that is invisible or undetectable through visual inspection, while maintaining manageable circuit complexity through integration with existing I/O structures.
Solution Approach 2:
The sensing conductive wire line acts as an intermediary element between the seal ring and the detection circuit. It is positioned adjacent to the seal ring to sense damage indirectly, then transmits this information to the I/O interface circuit for processing. This intermediary approach allows damage detection without requiring direct contact with the seal ring or complex imaging systems, resolving the contradiction between detection precision and device complexity.
2Measurement precision
If the sensing wire line is placed adjacent to the seal ring, then the detection capability is improved, but the risk of moisture penetration increases
Solution Approach 1:
The sensing conductive wire line is implemented as a thin conductive structure that can be integrated into the existing die architecture. It is positioned in the annular region between the seal ring and the peripheral edge, utilizing the existing sealed environment. The wire line's thin-film nature allows it to sense damage through the sealed region without compromising the seal's integrity, enabling detection while preventing moisture penetration.
Solution Approach 2:
The sensing wire line creates an electrical copy or model of the seal ring's condition. By monitoring the electrical properties of this conductive path that mirrors the seal ring's geometry and environment, the system can detect damage to the seal ring indirectly. This copying approach allows the sensing element to be positioned close to the seal ring for optimal detection while remaining electrically isolated and protected from moisture.
3Measurement precision
If the sensing wire line extends around the seal ring, then the detection coverage is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The sensing conductive wire line is designed to serve multiple functions: it acts as both a structural element and a sensing element. By integrating the sensing function into an existing conductive structure that is part of the I/O interface, the patent eliminates the need for separate precision-placed sensing elements. The wire line's dual role allows it to be manufactured using standard processes without requiring additional precision placement steps, while still providing comprehensive damage detection coverage around the seal ring.
Solution Approach 2:
The patent merges the sensing wire line with the existing I/O interface circuitry and conductive structures. Rather than being a separate component requiring independent placement, the sensing element is combined with functional conductive paths that already exist in the die design. This merging approach allows the sensing function to be achieved through standard manufacturing processes, reducing precision requirements while maintaining comprehensive detection coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable detection of damage caused by the dicing process, preventing functional failures by identifying cracks or chips at the peripheral edge of the integrated circuit die, thereby ensuring quality control and potential discarding of defective dies.
Implementation Method 1
testing the continuity and conductivity of the sensing wire line to detect damage
Data Source
AI summary
An integrated circuit die has a peripheral edge and a seal ring extending along the peripheral edge and surrounding a functional integrated circuit area. A test logic circuit located within the functional integrated circuit area generates a serial input data signal for application to a first end of a sensing conductive wire line extending around the seal ring between the seal ring and the peripheral edge of the integrated circuit die. Propagation of the serial input data signal along the sensing conductive wire line produces a serial output data signal at a second end of the sensing conductive wire line. The test logic circuit compares data patterns of the serial input data signal and serial output data signal to detect damage at the peripheral edge of the integrated circuit die.