IC Die Frontside Cooling with Autonomous Fluid Routing
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Solution Overview
Problem
Existing heat removal systems for high-density power integrated circuit devices often have high thermal resistance at the junction region, which hampers efficient heat dissipation, as they primarily focus on backside cooling and neglect the front side thermal resistance.
Innovation Solution
A cooling module assembly with micro-channels on the backside of the IC die, a temperature-responsive valve system, and a fluid circulation pump to create a closed-loop autonomous cooling circuit, allowing for efficient heat transfer from the junction region to a cooling fluid and subsequent recirculation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional backside cooling systems are used, then heat removal from the IC device is achieved, but high thermal resistance at the junction region on the front side limits effective heat dissipation
Solution Approach 1:
The patent inverts the conventional cooling approach by moving from backside cooling to frontside cooling. Micro-channels are etched directly into the front surface of the IC die, allowing cooling fluid to contact the junction region directly. This inversion eliminates the thermal resistance barrier of the substrate and interface materials that plague conventional backside cooling systems, enabling efficient heat removal from the hottest region.
Solution Approach 2:
The patent extracts the cooling function from the separate backside cooling system and integrates it directly into the junction region. By etching micro-channels into the die itself and positioning cooling fluid outlets in direct contact with the junction, the cooling function is extracted and placed exactly where it is needed, eliminating thermal resistance at the interface between the cooling system and the heat-generating junction.
2Temperature
If cooling fluid flow rate is increased to improve heat dissipation, then thermal resistance decreases, but thermal stresses and hotspots may increase without proper regulation
Solution Approach 1:
The patent implements feedback control through temperature-responsive valves that automatically regulate cooling fluid flow based on real-time temperature conditions. The valves sense the temperature of the cooling fluid and adjust their opening degree accordingly, increasing flow when heat generation is high and reducing flow when cooling is sufficient. This closed-loop feedback mechanism optimizes heat dissipation while preventing excessive thermal stresses and hotspots.
Solution Approach 2:
The cooling system is self-regulating through temperature-responsive valves that autonomously adjust flow rates without external control. The valves respond directly to temperature changes in the cooling fluid, automatically increasing or decreasing flow to match the thermal conditions of the IC device. This self-service capability ensures optimal cooling performance while minimizing thermal stresses.
3Temperature
If micro-channels are etched into the die to enable direct cooling, then heat transfer efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent uses hydraulic principles by etching micro-channels into the die and utilizing cooling fluid flow through these channels to achieve direct cooling. The micro-channel network is designed to distribute cooling fluid efficiently across the junction region, leveraging fluid dynamics to enhance heat transfer. This hydraulic approach enables effective cooling while maintaining manufacturability through established micro-fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces thermal resistance, mitigates thermal stresses, and enhances temperature uniformity, improving the reliability of the integrated circuit device by autonomously regulating the cooling fluid flow and effectively dissipating heat from the junction region.
Implementation Method 1
heat is transferred from the junction region of the integrated circuit die to the cooling fluid
Implementation Method 2
heat is transferred from the junction region of the integrated circuit die to the cooling fluid flowing through the micro-channels
Implementation Method 3
at least one temperature-responsive valve positioned within the at least one fluid routing channel, wherein the at least one temperature-responsive valve is configured to autonomously regulate a flow rate of the cooling fluid
Implementation Method 4
a heat exchanger that includes at least one cooling channel fluidly connected to the at least one fluid routing channel and the fluid circulation pump
Data Source
AI summary
An integrated circuit device is provided. The integrated circuit device includes a die having a first surface and a second surface opposite the first surface. The die has at least one circuit element positioned on its first surface. At least one micro-channel is defined in the second surface of the die. The integrated circuit device includes a cooling substrate attached to the second surface of the die. At least one fluid routing channel is defined in the cooling substrate. The at least one fluid routing channel is connected to the at least one micro-channel defined in the die. Additionally, the cooling substrate has at least one valve positioned within the at least one fluid routing channel. The at least one valve is configured to autonomously regulate a flow rate of a cooling fluid flowing through the at least one fluid routing channel.