IC Die Ground Connection via Through-Hole Conductor
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Solution Overview
Problem
Wire sweep and die delamination issues arise in IC package manufacturing due to improper alignment and handling of bond wires during the wire bonding process, particularly when stitch bonds on the die attachment pad cause the die to detach, and the mutual inductance of adjacent wires is affected.
Innovation Solution
An integrated circuit die with ground connection traces exposed through a central hole filled with conductive material, eliminating the need for bond wires connected to the die attachment pad, thereby reducing wire sweep and preventing die delamination by ensuring electrical connection between ground traces and the leadframe without bond wires on the die attachment pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect IC dies to leadframes, then electrical connection is achieved, but wire sweep and die delamination occur due to improper alignment and stitch bonding
Solution Approach 1:
The patent extracts the harmful stitch bonding operation from the die attachment pad area by using through-die vias to establish ground connections. This removes the source of wire sweep and delamination while maintaining necessary electrical connections through alternative means.
Solution Approach 2:
The patent introduces through-die vias filled with conductive material as an intermediary structure to establish ground connections between the die and leadframe. This mediator eliminates the need for stitch bonds on the attachment pad, preventing wire sweep while maintaining electrical connectivity.
2Reliability
If stitch bonds are performed on the die attachment pad, then ground connection is achieved, but the die delaminates from the pad
Solution Approach 1:
The patent segments the ground connection function from the mechanical attachment function. Through-die vias provide the ground connection path separately from the die attachment pad, allowing the pad to maintain strong mechanical bonding without the damaging effect of stitch bonds.
Solution Approach 2:
The patent extracts the ground connection function from the die attachment pad by routing it through through-die vias. This separation prevents stitch bonds from being applied to the pad, thereby preventing delamination while maintaining ground connectivity.
3Area of stationary object
If bond wires are positioned close together, then space utilization is improved, but mutual inductance between adjacent wires increases
Solution Approach 1:
The patent applies local quality by providing ground connections at specific locations through through-die vias. This localized ground connection approach allows for optimized wire routing that reduces mutual inductance while maintaining effective space utilization in the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of wire sweep and die delamination by increasing the space between bond wires and eliminating stitch bonds on the die attachment pad, enhancing electrical performance and reliability of the IC package.
Implementation Method 1
filling the hole with conductive material and attaching the die to a leadframe
Data Source
AI summary
An integrated circuit (IC) die including a top surface and a bottom surface, a plurality of spaced apart ground connection traces positioned between the top surface and the bottom surface; with a hole in the die exposing the plurality of spaced apart ground connection traces.