IC Die Interface Layout for Symmetric Parallel Bus Routing

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Solution Overview

Problem

The challenge in semiconductor device packaging is arranging contact element patterns for improved connectivity between IC dies in 2.5D semiconductor devices, particularly in achieving symmetric and efficient signal transmission and reception across interfaces in 2.5D packaging technology.

Innovation Solution

The contact elements are arranged in a geometrically symmetric pattern with identical sequences for transmitting and receiving groups, allowing for easy disposition on interposers or RDL, and maintaining equal and short routing lengths, even after geometric rotation, facilitating high-frequency, synchronous parallel bus communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If contact element patterns are arranged asymmetrically for connection between dies, then the connection can be established, but the routing length difference between transmitting and receiving signals increases, causing time delay and reduced signal quality

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidcontact element arrangement complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies asymmetry in reverse - it deliberately creates symmetry in the contact element arrangement. The contact elements are arranged such that the transmitting group and receiving group have identical routing lengths and symmetric positions, which eliminates the time delay issue caused by asymmetric routing while maintaining connection reliability

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent performs preliminary arrangement of contact elements during the design stage to ensure symmetric routing paths. By pre-configuring the contact element positions and sequences before actual signal transmission, the routing length equality is guaranteed, eliminating the need for complex post-adjustment and reducing signal quality issues

Inventive Principle:
Principle #10Preliminary action

2Speed

If contact elements are arranged to minimize routing length, then signal transmission speed improves, but the arrangement becomes complex and difficult to align with another die

Engineering Contradiction:
Improvesignal transmission speedVSAvoidalignment ease
Core Design Contradiction:
SpeedVSEase of manufacture

Solution Approach 1:

The patent uses symmetry (reverse application of asymmetry principle) to create identical routing patterns for transmitting and receiving groups. This symmetric arrangement ensures that both dies have matching contact element positions, making alignment straightforward while maintaining short routing lengths for high-speed signal transmission

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent creates equipotential conditions by ensuring that all corresponding contact elements in the transmitting and receiving groups have equal routing lengths. This equality in electrical path length simplifies the alignment process between dies, as the symmetric pattern provides natural registration marks and reduces alignment tolerance requirements

Inventive Principle:
Principle #12Equipotentiality

3Adaptability or versatility

If the contact element sequence for transmitting and receiving groups is different, then the interface can handle diverse signal types, but the time difference between transmission and reception increases, reducing synchronous communication performance

Engineering Contradiction:
Improvesignal type flexibilityVSAvoidtransmission-reception time difference
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent applies local quality by assigning different functions to corresponding contact elements while maintaining identical routing characteristics. Each contact element position handles specific signal types (transmitting or receiving), but the symmetric arrangement ensures that the physical path length is equal, thus maintaining time synchronization while allowing functional diversity

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent segments the contact elements into transmitting groups and receiving groups, with each group having dedicated contact elements for specific signal directions. This segmentation allows for optimized signal handling in each group while the overall symmetric arrangement ensures that corresponding segments have equal routing lengths, maintaining synchronous communication performance

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11742295B2Interface of integrated circuit die and method for arranging interface thereof
Publication Date: 2023.08.29 GLOBAL UNICHIP CORPORATION
  • US11742295B2 patent drawing
  • US11742295B2 patent drawing
  • US11742295B2 patent drawing

AI summary

An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.