IC Die Pickup and Mount Stretching for Damage-Free Removal
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Solution Overview
Problem
Current methods for removing integrated circuit (IC) die from mount materials often result in damage, breakage, and high costs due to insufficient handling and peeling forces, which complicates the manufacturing process and limits the ability to produce higher performance and lower cost products with increasing IC density.
Innovation Solution
A system utilizing linear and rotary motion to hold and stretch the mount material, applying dispersed physical stress through blades and centrifugal force to remove the IC die without direct force, thereby reducing damage and improving handling reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a die eject force becomes too great to overcome adhesive force, then the IC die can be removed from mount material, but the IC die can be damaged (breakage, scoring, chipping)
Solution Approach 1:
A pick-up apparatus with a pickup element acts as an intermediary between the mount material and the removal system. The pickup element engages the IC die at a safe location (corner or edge) and applies distributed lifting force through controlled motion, preventing concentrated stress that causes damage while still enabling die removal.
Solution Approach 2:
The system uses dynamic motion control with linear and rotary stages to gradually stretch the mount material and lift the IC die. This controlled dynamic approach distributes the eject force over time and area, preventing sudden stress concentrations that cause breakage, scoring, or chipping.
2Reliability
If radiation removal methods are used to solve mount material removal, then IC die damage is reduced, but costs become very expensive
Solution Approach 1:
The patent replaces expensive radiation-based removal methods with a mechanical system consisting of a pick-up apparatus and motion-controlled stretching mechanism. This mechanical approach achieves die removal without damage at lower cost by using controlled linear and rotary motion to gradually peel the mount material away.
Solution Approach 2:
The system uses a disposable or reusable pick-up element that can be easily replaced if needed, avoiding the high cost of radiation equipment. The simple mechanical components are far less expensive than radiation removal systems while achieving the same functional result.
3Reliability
If uneven release methods are used to remove mount material, then IC die damage is reduced, but the pick-up apparatus has insufficient hold on the IC die resulting in dropping
Solution Approach 1:
The pick-up apparatus establishes a secure hold on the IC die before the stretching and removal process begins. The pickup element engages the die at a predetermined safe location, ensuring adequate grip is established in advance before any force is applied to overcome adhesive bonds.
Solution Approach 2:
The system separates the pick-up function from the stretching function. The pick-up element provides a dedicated gripping mechanism that maintains hold on the IC die, while the linear and rotary stages provide the stretching motion. This segmentation ensures the hold function is optimized independently from the removal action.
4Productivity
If needle pushing force is applied to remove IC die, then mount material is removed, but the needle cracks or breaks the IC die or scores/chips the circuitry
Solution Approach 1:
The pick-up apparatus serves as an intermediary that lifts the IC die from a safe distance rather than pushing from below. This eliminates the needle-pushing method entirely, replacing it with a top-down lifting approach that applies force through the pickup element at the die surface, preventing internal stress and circuitry damage.
Solution Approach 2:
Instead of pushing the IC die up from below through the mount material (needle method), the system pulls the IC die up from above using the pick-up apparatus. This inverted approach reverses the force application direction, eliminating the risk of cracking or chipping caused by upward pushing forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces damage to the IC die by dispersing stress across its surface, enhancing handling and manufacturing yield while maintaining cost-effectiveness, particularly for thin IC dies below 50 um in thickness.
Implementation Method 1
A system utilizing linear and rotary motion to stretch and remove the mount material, applying dispersed physical stress through blades and centrifugal force to prevent damage to the IC die
Data Source
AI summary
A system for removal of an integrated circuit from a mount material including holding and stretching the mount material using linear and rotary motion, and removing the integrated circuit from the mount material when the mount material is stretched by linear and rotary motion.