Indented IC Die Scribe Region for Larger Alignment Marks

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Solution Overview

Problem

Conventional scribe regions in semiconductor wafers have uniform widths that result in wasted space due to accommodating the largest in-frame structures, limiting the usable area for active devices in integrated circuit (IC) dies.

Innovation Solution

The introduction of an IC die with an indentation in its perimeter, featuring a scribe region with two sections: a first section along the edge perimeter and a second section within the indentation, where the second section has a wider width to accommodate larger in-frame structures, while the first section has a narrower width for smaller structures, optimizing the use of space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a uniform width scribe region is used to accommodate the widest in-frame structure, then all in-frame structures can be accommodated, but wasted area increases reducing active device area

Engineering Contradiction:

Improveactive device areaVSAvoidscribe region design

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The scribe region is designed with non-uniform width, having a first width in a first portion and a second width in a second portion, where the widths differ to match the specific requirements of different in-frame structures. This local differentiation allows each section to be optimally sized for its intended function, maximizing active device area while maintaining manufacturability.

Inventive Principle:

Principle #3Local quality

2Area of stationary object

If a single uniform scribe region width is used, then manufacturing is simplified, but space is wasted that cannot be used for active devices

Engineering Contradiction:

Improveusable scribe region areaVSAvoidscribe region structure

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The scribe region is segmented into a first portion and a second portion along the edge perimeter, with each portion having a different width. This segmentation allows the scribe region to be optimized for different functions in different areas, increasing the usable area for in-frame structures without creating excessive complexity.

Inventive Principle:

Principle #1Segmentation

3Area of stationary object

If the scribe region width is reduced to save space, then more active device area is available, but space for in-frame structures may be insufficient

Engineering Contradiction:

Improveactive device areaVSAvoidin-frame structure accommodation

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

Different sections of the scribe region are assigned different widths based on the specific requirements of the in-frame structures they need to accommodate. This ensures that each in-frame structure has sufficient space while minimizing the overall scribe region area, thereby maximizing active device area without compromising reliability.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250343172A1Structure with IC die with enlarged area in scribe region

Publication Date: 2025.11.06 GLOBALFOUNDRIES SINGAPORE PTE LTD

AI summary

A structure includes an IC die having an edge perimeter and an indentation extending inwardly at a portion of the edge perimeter. The structure also includes a scribe region including a first section defined along the edge perimeter of the IC die and a second section defined in the indentation. The first section has a first width relative to the edge perimeter and the second section has a second width relative to the edge perimeter greater than the first width. The second section of the scribe region provides a wider, enlarged area for wider in-frame structures, such as alignment marks, while the first section of the scribe region has a smaller width to provide area for smaller in-frame structures.