IC Die Size Reduction via Slack-Based Timing Analysis
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Solution Overview
Problem
Current integrated circuit (IC) design methods struggle to minimize die size without impacting non-critical timing signal paths, as they rely on optimistic or pessimistic assumptions about voltage and temperature variations, leading to inefficiencies in die size reduction.
Innovation Solution
A circuit analysis tool is developed to determine if die size can be reduced by modeling circuit elements with positive slack times, allowing for the replacement of larger die areas with smaller ones, and adding delay elements to maintain timing accuracy, thereby reducing the overall die size and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If die size is reduced to lower cost and power consumption, then manufacturing cost and energy use decrease, but timing accuracy may deteriorate
Solution Approach 1:
The patent applies local quality by differentiating between critical and non-critical timing paths. For non-critical paths, smaller die-sized circuit elements are used where timing margin exists, while critical paths maintain larger elements for timing accuracy. This localized optimization reduces overall die size and power consumption without compromising critical timing requirements.
Solution Approach 2:
The patent changes the parameter of die size for circuit elements based on timing path characteristics. By analyzing slack values and timing margins, the system selectively reduces die size in non-critical paths while maintaining original sizes in critical paths, achieving a balance between power consumption and timing accuracy.
2Ease of manufacture
If die size is reduced, then manufacturing cost decreases, but circuit performance may deteriorate
Solution Approach 1:
The patent implements local quality by applying different die size optimization strategies to different circuit paths. Non-critical paths receive aggressive size reduction for cost savings, while critical paths maintain larger sizes for performance reliability, achieving both manufacturing economy and circuit performance.
Solution Approach 2:
The patent applies partial action by selectively reducing die size only in non-critical timing paths where slack exists, rather than uniformly reducing all elements. This partial optimization maintains circuit performance in critical paths while achieving cost reductions in less sensitive areas.
3Area of stationary object
If die size is reduced, then congestion in critical areas decreases, but timing margins may be compromised
Solution Approach 1:
The patent applies local quality by identifying and treating different spatial regions of the circuit differently. Areas with congestion and non-critical timing paths receive die size reduction, while critical paths maintain larger element sizes, simultaneously reducing congestion and preserving timing margins where needed.
Data Source
AI summary
A circuit analysis tool is provided for die size reduction analysis. A processor determines a first initial output slack time. If the first initial output slack time is greater than zero, a first circuit element is modeled with a second die area, less than the first die area. The second die area is associated with a third delay greater than the first delay. Then, the second data signal is modeled equal to the first data signal with the third delay. If a first modified output slack time is greater than or equal to zero, the first circuit element first die can be replaced with the second die. If the first modified output slack time is a first value less than zero, a first delay is added to the clock signal that is greater than or equal to the first value.