Integrated Circuit Assembly with Direct Conductive Sheet Connections
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Solution Overview
Problem
Existing integrated circuit mounting methods, particularly for fine pitch surface mount integrated circuits, face challenges in minimizing resistance and heat dissipation due to the use of leads and soldering processes, which can limit current capacity and require external heat sinks.
Innovation Solution
The integration of electrically conductive sheets with a non-conductive material and an electrical trace, allowing direct connection of integrated circuit leads to the sheets and trace, which reduces resistance and facilitates heat dissipation, while a circuit board with control circuits provides control signals through conductive vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leads and soldering processes are used to mount integrated circuits, then the integrated circuit can be connected to the circuit board, but the resistance increases and heat dissipation capability decreases
Solution Approach 1:
The patent extracts and eliminates the traditional soldering process and intermediate solder joints from the connection path. By directly connecting integrated circuit leads to conductive sheets through plated holes, the invention removes the soldering step that introduces additional resistance, thereby reducing energy loss while maintaining connection reliability
Solution Approach 2:
The patent segments the connection structure into distinct functional layers: conductive sheets with plated holes, non-conductive material for insulation, and direct lead-to-sheet connections. This segmentation allows each component to be optimized independently, with conductive sheets providing low-resistance paths and non-conductive material providing electrical isolation, thereby reducing overall resistance without compromising connection integrity
2Reliability
If leads and soldering processes are used to mount integrated circuits, then the integrated circuit can be connected to the circuit board, but the heat dissipation capability is limited and external heat sinks are required
Solution Approach 1:
The patent merges the electrical connection function with the heat dissipation function into a single integrated structure. The conductive sheets serve dual purposes: providing electrical connection paths and acting as heat sinks. By combining these functions, the invention eliminates the need for separate external heat sinks while maintaining effective heat dissipation and reliable electrical connections
Solution Approach 2:
The patent introduces non-conductive material as an intermediary substance that fills the space between conductive sheets and provides thermal pathways. This intermediary material enables heat transfer from the integrated circuit leads through the conductive sheets while maintaining electrical isolation, thereby improving heat dissipation capability without compromising connection reliability
3Loss of energy
If conductive sheets with direct connections are used, then resistance is minimized and heat dissipation is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies preliminary plating to the conductive sheets before assembling the final structure. By pre-plating the holes and surfaces with conductive material, the invention simplifies the overall manufacturing process, as the low-resistance connection paths are already established before the integrated circuit is mounted, reducing both resistance loss and manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes current path resistance, enhances heat dissipation, and potentially eliminates the need for external heat sinks, improving the performance and efficiency of integrated circuit assemblies in applications like power converters.
Implementation Method 1
a non-conductive material disposed between the first and second electrically conductive sheets
Implementation Method 2
an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets
Implementation Method 3
soldering at least one lead of an integrated circuit directly to each of the first and second electrically conductive sheets
Implementation Method 4
a conductive via formed in at least the non-conductive material and electrically isolated from the first and second electrically conductive sheets
Data Source
AI summary
An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.