Distributed Temperature Sensing in Integrated Circuits
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Solution Overview
Problem
Integrated circuits face challenges in controlling die temperature due to increasing power densities, leading to reduced performance and lifetime, with external temperature measurement methods being impractical and inaccurate, especially for programmable logic devices where temperature gradients are difficult to ascertain during design and runtime.
Innovation Solution
The integration of internal temperature sensing devices and ring-oscillators within the integrated circuit allows for distributed temperature sensing, enabling temperature measurements without external equipment, with a transfer function generated to correlate frequency changes with temperature readings, facilitating both design-time and runtime monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external temperature measuring devices are used, then temperature measurement capability is provided, but device complexity and impracticality increase
Solution Approach 1:
The integrated circuit performs temperature measurement autonomously using internal ring oscillators and temperature sensing circuits, eliminating the need for external thermocouples or measurement equipment. The circuit generates its own measurement signals and processes temperature data internally through transfer functions.
Solution Approach 2:
Temperature sensing functionality is nested within the integrated circuit structure itself. Ring oscillators are embedded among circuit components, and temperature sensing circuits are integrated into the fabric of the IC, allowing temperature measurement to occur at multiple hierarchical levels within the device.
2Measurement precision
If temperature sensing is implemented externally, then temperature data can be obtained, but measurement accuracy and correlation reliability deteriorate due to die-to-die variations
Solution Approach 1:
Multiple ring oscillators are distributed at different locations within the integrated circuit to capture local temperature variations. Each oscillator provides temperature information specific to its local region, enabling accurate measurement of temperature gradients and hot spots without being affected by die-to-die variations.
Solution Approach 2:
The temperature measurement function is segmented into multiple distributed ring oscillators rather than using a single external sensor. This segmentation allows independent measurement at different circuit locations, providing localized temperature data that is more reliable and less susceptible to variations between different dies.
3Measurement precision
If temperature monitoring is performed after IC fielding, then runtime temperature data can be collected, but temperature gradient assessment becomes impractical
Solution Approach 1:
The integrated circuit continuously monitors its own temperature in real-time during operation without requiring external intervention. The distributed ring oscillators automatically provide temperature data at runtime, enabling practical temperature gradient assessment and hot spot detection during actual device operation.
4Productivity
If higher power density is implemented to improve circuit performance, then circuit functionality and speed improve, but temperature control and thermal management become more difficult
Solution Approach 1:
The distributed ring oscillators provide continuous temperature feedback from different locations within the circuit. This feedback enables dynamic thermal management by allowing the system to detect temperature increases and adjust operation accordingly, maintaining performance while preventing thermal runaway even at high power densities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate, internal temperature monitoring and gradient assessment across the die, allowing for proactive control of temperature spikes and improved performance by detecting and mitigating thermal issues without the need for external devices, enhancing reliability and flexibility.
Implementation Method 1
the plurality of ring-oscillators is used to provide one or more temperature measurements for the integrated circuit
Implementation Method 2
an internal temperature sensing device deployed among the plurality of circuit components, where the internal temperature sensing device provides a first temperature measurement in a first mode of operation and a second temperature measurement in a second mode of operation
Implementation Method 3
a processor to generate a transfer function using the first temperature measurement, the second temperature measurement, the first frequency control value, and the second frequency control value
Data Source
AI summary
In one embodiment, an integrated circuit for providing distributed temperature sensing is disclosed. For example, the integrated circuit comprises a plurality of circuit components, an internal temperature sensing device deployed among the plurality of circuit components; and a plurality of ring-oscillators deployed among the plurality of circuit components, wherein at least one of the plurality of ring-oscillators is deployed adjacent to the internal temperature sensing device, where the plurality of ring-oscillators is used to provide one or more temperature measurements, e.g., a temperature gradient, for the integrated circuit.