IC Electroluminescence Imaging for Non-Destructive Integrity Verification
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Solution Overview
Problem
Existing methods for inspecting integrated circuits (ICs) are destructive, time-consuming, and unable to detect unauthorized software or firmware modifications, posing a security risk, especially in complex international supply chains.
Innovation Solution
Non-destructive electroluminescent imaging and analysis methods are used to compare the electroluminescent emissions of IC devices with a reference model to verify their structural and functional integrity, including software and firmware validation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If physical inspection is performed to determine whether an IC design was faithfully reproduced, then manufacturing precision is improved, but the inspection process becomes destructive and time-consuming
Solution Approach 1:
The patent replaces physical/mechanical inspection methods with optical detection. Instead of manually de-packaging and imaging IC layers with electron microscopes, the system uses electroluminescence imaging to detect unauthorized modifications through light emission patterns, eliminating the need for destructive physical examination
Solution Approach 2:
The patent creates optical copies (images) of the IC device's electroluminescence patterns and compares them against reference models. This allows verification of IC design reproduction accuracy by comparing light emission patterns rather than physically examining the actual device structure, enabling rapid non-destructive validation
2Measurement precision
If physical inspection is performed to detect unauthorized modifications, then measurement precision is improved, but the object being inspected is destroyed
Solution Approach 1:
The patent substitutes optical detection for mechanical physical inspection. By imaging the electroluminescence patterns emitted by the IC device, the system can detect unauthorized hardware or software modifications without physically touching or damaging the device, maintaining both detection precision and device integrity
Solution Approach 2:
The patent introduces electroluminescence imaging as an intermediary detection method. Instead of directly examining the IC structure through physical disassembly, the system uses light emission patterns as an intermediate signal that reveals information about the device's authenticity and modifications without causing harm
3Manufacturing precision
If traditional inspection methods are used to verify IC devices, then manufacturing precision is improved, but productivity decreases due to destruction of inspected parts
Solution Approach 1:
The patent replaces destructive mechanical inspection with non-destructive optical imaging. Multiple IC devices can be rapidly imaged and verified against reference models using electroluminescence patterns, allowing inspection of entire batches without destroying any parts, thereby dramatically increasing inspection throughput and productivity
Solution Approach 2:
The patent performs preliminary optical verification of IC devices before they proceed further in the supply chain. By using electroluminescence imaging to pre-screen devices for unauthorized modifications, the system can quickly identify and isolate problematic devices without requiring time-consuming physical inspection of every unit
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for rapid, non-destructive verification of ICs, detecting hardware and software deviations from a trusted design, enhancing security by identifying unauthorized modifications and ensuring compliance with specifications.
Implementation Method 1
technologies for verifying and validating electronic devices using electroluminescence
Data Source
AI summary
In an approach to inspecting integrated circuits, a system includes a first detection system and a second detection system for measuring electroluminescent (EL) images from a device under test (DUT); and a controller. The controller is configured to: measure EL emissions from the DUT with the first and the second detection systems to obtain a first and a second EL test data; compare the first and the second EL test data to a reference model of a reference device, the reference model developed based on measured EL reference data, synthetic EL reference data, or a combination thereof obtained from the reference device or a reference design of the reference device; and determine whether the DUT is in accordance with the reference device, based at least in part on the comparison of the first and the second EL test data to the reference model of the reference device.