Integrated Circuit Electromagnetic Shielding via Steady Voltage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing integrated circuits (ICs) face challenges in preventing electromagnetic interference (EMI) without incurring high costs and consuming excessive space, as current solutions involving metal objects or wave-absorbing materials are not cost-effective for miniaturization applications.
Innovation Solution
An integrated circuit with an electromagnetic shielding layer and conducting paths that connect to a steady voltage, ensuring the current through the shielding layer is zero or less than the maximum current in the radiation area, effectively shielding electromagnetic waves without significant power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If soft/hard metal objects or wave-adsorbing materials are used to cover the packaged IC, then electromagnetic shielding capability is improved, but cost and circuit board area consumption increase
Solution Approach 1:
The patent merges the electromagnetic shielding function with the IC package structure itself by integrating a shielding layer and conducting paths directly into the package. This eliminates the need for separate external shielding materials, thereby reducing circuit board area while maintaining shielding effectiveness.
Solution Approach 2:
The IC package is designed to serve multiple functions: it provides both structural protection for the IC and electromagnetic shielding capability. The integrated shielding structure allows the package to simultaneously fulfill mechanical and electromagnetic protection roles, reducing the need for additional components.
2Object-affected harmful factors
If soft/hard metal objects or wave-adsorbing materials are used to cover the packaged IC, then electromagnetic shielding capability is improved, but manufacturing cost increases
Solution Approach 1:
The shielding structure is combined with the IC package manufacturing process, allowing both to be produced simultaneously in the same fabrication line. This integration eliminates the need for separate assembly steps and reduces overall manufacturing cost.
Solution Approach 2:
The patent uses standard semiconductor manufacturing materials and processes with controlled parameters to create the shielding layer and conducting paths. By utilizing existing manufacturing capabilities and optimizing process parameters, the solution achieves effective shielding without requiring expensive specialized materials or processes.
3Object-affected harmful factors
If a shielding layer is added to the IC package, then electromagnetic shielding capability is improved, but device complexity increases
Solution Approach 1:
The shielding layer is strategically positioned only where electromagnetic radiation occurs within the IC package, rather than uniformly covering the entire structure. The conducting paths are also placed specifically to connect with steady voltage at critical points, providing targeted shielding that reduces overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective electromagnetic shielding while being cost-effective and space-efficient, superior to prior art methods, by minimizing current through the shielding layer and preventing significant electromagnetic wave generation.
Implementation Method 1
an electromagnetic shielding layer such as a metal layer covering the first surface and including at least one contact; and at least one conducting path such as a bonding wire operable to electrically connect the at least one contact with a steady voltage and thereby shield off the electromagnetic wave from the electromagnetic radiation area
Data Source
AI summary
The present invention discloses an integrated circuit having electromagnetic shielding capability and the manufacturing method thereof. An embodiment of the said integrated circuit comprises: a semiconductor circuit structure including a first surface which covers an electromagnetic radiation area; an electromagnetic shielding layer covering the first surface and including at least one contact; and at least one conducting path operable to electrically connect the at least one contact with a steady voltage and thereby shield off the electromagnetic wave from the electromagnetic radiation area, wherein the current running through the electromagnetic shielding layer is zero or less than the maximum current running through the electromagnetic radiation area.