Integrated Circuit Feature Configuration via Fuse and Flash Programming
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Solution Overview
Problem
The existing manufacturing process of multi-function integrated circuits results in increased costs for users due to the inclusion of unwanted features, as manufacturers must produce a single chipset for various systems, leading to platform fragmentation and higher end-user costs.
Innovation Solution
A system and method that allows for the selective enabling or disabling of features in integrated circuits during the manufacturing process, using a feature selector and key-based authorization to configure processing components to order, enabling manufacturers to build systems with only the desired features, reducing costs and increasing flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If manufacturers produce single integrated circuit device types with all functions included, then manufacturing costs are reduced and device versatility is improved, but purchasers must pay for unwanted functions and platform fragmentation increases
Solution Approach 1:
The integrated circuit is segmented into multiple feature sets, where each feature set represents a distinct functional capability. The circuit includes feature selection logic that can selectively enable or disable specific feature sets based on configuration, allowing the same physical device to provide different functional configurations without requiring multiple manufacturing processes.
Solution Approach 2:
The integrated circuit incorporates dynamic feature selection capability, allowing the device to transition between different functional states. Feature sets can be selectively enabled or disabled through configuration mechanisms (such as fuses, OTP memory, or software control), making the device adaptable to different application requirements while maintaining a single manufacturing process.
2Ease of manufacture
If fuses are blown during manufacture to differentiate integrated circuit functions, then test costs are reduced and manufacturing is simplified, but system integrators must define multiple types of printed circuit boards resulting in platform fragmentation
Solution Approach 1:
The printed circuit board is designed as a universal platform that can accommodate multiple types of integrated circuits with different feature set configurations. The board includes configuration mechanisms that work with various device types, allowing a single board design to support differentiated functionality through device-level configuration rather than requiring multiple board variants.
Solution Approach 2:
An intermediary configuration mechanism (such as a configuration register, fuse array, or programmable logic layer) is introduced between the integrated circuit and the printed circuit board. This intermediary allows functional differentiation to occur at the device level while maintaining a unified board platform, decoupling the function selection from the physical board design.
3Adaptability or versatility
If multiple types of integrated circuits are produced to meet different system needs, then system configuration flexibility is improved, but manufacturing complexity and end user costs increase
Solution Approach 1:
The integrated circuit is pre-configured with multiple feature sets during manufacturing, with configuration bits or fuses prepared but not yet activated. This preliminary preparation allows the device to be quickly adapted to different configurations through simple activation steps (such as blowing fuses or writing to configuration memory) without requiring complex re-manufacturing processes.
Solution Approach 2:
The integrated circuit uses parameter changes (such as configuration bits, fuse states, or programmable logic settings) to differentiate between different functional versions. By changing logical parameters rather than physical manufacturing parameters, the system can provide multiple configurations from a single manufacturing process, reducing both manufacturing complexity and device variety.
Data Source
AI summary
Processing components to manufacture information handling systems have build-to-order integrated circuits with plural selectively-enabled features set at the information handling system manufacture location. For instance, fuses integrated in the integrated circuits are selectively blown at the information handling system manufacture location to permanently disable features so that the processing components have a desired configuration. As another example, feature enable or disable states are programmed in flash incorporated in the integrated circuit, with the flash programmability subsequently disabled to permanently set the features so that the processing components have a desired configuration. Features are set with keys provided by the processing component manufacturer to track the information handling system manufacturer's use of the features.