Low-Profile IC Footprint Adapter for Inspection and Rework

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing solutions for interfacing surface mount device (SMD) integrated circuits (ICs) with dissimilar PCB footprints face issues of increased complexity, cost, height interference, and lack of thermal conductivity, while also preventing post-assembly optical inspection and rework.

Innovation Solution

An adapter with a guest interface for the IC package, a host interface for the PCB footprint, and interconnecting traces, maintaining minimal height and incorporating metal-plated half-holes for optical inspection and rework, while providing a thermally conductive path.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If formed leads are used to interface IC with PCB, then footprint compatibility is achieved, but device complexity and cost increase significantly

Engineering Contradiction:

Improvefootprint compatibilityVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent introduces an adapter as an intermediary component that provides footprint compatibility without requiring complex formed leads. The adapter includes a first interface that mates with the IC package and a second interface that matches the PCB footprint, serving as a simple mediating structure that eliminates the need for complex lead formation while maintaining adaptability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If formed leads are used to interface IC with PCB, then footprint compatibility is achieved, but package height increases interfering with enclosures

Engineering Contradiction:

Improvefootprint compatibilityVSAvoidpackage height

Core Design Contradiction:

Adaptability or versatilityVSLength of moving object

Solution Approach 1:

The adapter serves as a low-profile intermediary that provides footprint compatibility without adding significant height. By using a planar adapter structure with copper traces instead of vertical formed leads, the solution achieves footprint adaptation while maintaining a minimal height profile that does not interfere with enclosures or other components.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If formed leads are used to interface IC with PCB, then footprint compatibility is achieved, but thermal conduction path is lost

Engineering Contradiction:

Improvefootprint compatibilityVSAvoidthermal conduction

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The adapter acts as a thermal intermediary by incorporating copper traces and thermal vias that create a conductive path between the IC and PCB. The copper material and vias structure serve as thermal bridges, allowing heat to flow from the IC through the adapter to the PCB, thus maintaining thermal conduction while providing footprint compatibility.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Device complexity

If blind soldering is used to cover footprint, then manufacturing complexity is reduced, but post-assembly inspection becomes impossible

Engineering Contradiction:

Improvedevice complexityVSAvoidinspection accessibility

Core Design Contradiction:

Device complexityVSDifficulty of detecting and measuring

Solution Approach 1:

The adapter serves as an inspection-friendly intermediary by providing accessible solder joints on its surfaces. The first and second interfaces of the adapter allow soldering to be performed and inspected from the sides or top, rather than requiring blind soldering through the PCB. This maintains low device complexity while enabling optical inspection and rework.

Inventive Principle:

Principle #24Intermediary (Mediator)

5Device complexity

If blind soldering is used to cover footprint, then manufacturing complexity is reduced, but rework capability is lost

Engineering Contradiction:

Improvedevice complexityVSAvoidrework capability

Core Design Contradiction:

Device complexityVSEase of repair

Solution Approach 1:

The adapter provides rework capability by serving as a removable intermediary component. The solder joints connecting the adapter to the IC and PCB can be accessed and reworked by desoldering the adapter from one or both sides, allowing for component replacement or repair without requiring complex rework procedures. This maintains simple device structure while enabling easy repair.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient electrical and thermal connection between ICs and PCBs with dissimilar footprints, allowing post-assembly inspection and rework, reducing complexity and height interference.

Implementation Method 1

providing a thermally conductive path

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

metal-plated half-holes to allow for optical inspection

Methodology Applied

Scientific EffectOptical transmission: Light

Data Source

PatentUS20250365867A1Adapter for Enabling the Interchange of Integrated Circuits with Dissimilar Surface Mount Device Footprints

Publication Date: 2025.11.27 MCGIMPSEY SCOTT THOMAS

AI summary

The invention is an adapter enabling the interchange of the use of Integrated Circuit components on a Printed Circuit Board with a dissimilar Surface Mount Device footprint with minimal impact to total component height and no obstruction of typical optical inspection methods. The invention indirectly resolves common constraints of electronic circuit designs, such as IC obsolescence, market availability, and design improvements without discarding existing materials.