Self-Aligning IC Geometrical Elements for PCB Placement

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Solution Overview

Problem

Current methods for positioning integrated circuits (ICs) on printed circuit boards (PCBs) rely on expensive and high-precision pick and place machines, which are operator-dependent and prone to inaccuracies due to the complexity of the process and external conditions.

Innovation Solution

The use of unique geometrical elements on the IC package that match a reversed pattern on the PCB, allowing for precise and accurate placement without the need for expensive machines, as the elements touch at multiple points to limit movement and ensure correct orientation, potentially serving as electrical contacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If expensive and high precision pick and place machines are used to position the IC package, then placement precision is improved, but device complexity and cost increase

Engineering Contradiction:
Improveplacement precisionVSAvoidmachine complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The IC package and PCB are designed with self-aligning geometrical elements (protrusions and recesses) that automatically guide the IC into the correct position during manual placement. This self-service mechanism eliminates the need for complex automated positioning systems, achieving high placement precision through the inherent geometry of the components rather than through sophisticated machinery.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The invention replaces expensive, complex pick and place machines with simple, inexpensive geometrical elements integrated into the IC package and PCB. These geometrical features act as disposable, built-in positioning aids that provide high-precision alignment without requiring costly external equipment.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Measurement precision

If multiple external positioning elements and conditions are used to establish position metrology, then positioning accuracy is improved, but the quantity of elements and process complexity increase

Engineering Contradiction:
Improvepositioning accuracyVSAvoidpositioning process complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The invention extracts the positioning function from external metrology systems and integrates it directly into the IC package and PCB structures. By embedding geometrical elements (protrusions and recesses) within the components themselves, the positioning accuracy is achieved through the components' own geometry rather than through external measurement systems and multiple positioning elements.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The positioning function is merged with the structural design of the IC package and PCB. The geometrical elements serve dual purposes: they are integral parts of the component structure and simultaneously provide the positioning metrology. This merging eliminates the need for separate positioning elements and external measurement systems.

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If manual placement without specialized machines is used, then device complexity and cost are reduced, but placement precision deteriorates

Engineering Contradiction:
Improveplacement equipment complexityVSAvoidplacement precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The geometrical elements (protrusions and recesses) provide self-aligning guidance during manual placement, allowing the operator to achieve high precision without specialized equipment. The self-service mechanism guides the IC into the correct position through its own geometry, compensating for the lack of automated positioning systems.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The geometrical elements are designed with asymmetric features (specific patterns of protrusions and recesses) that provide unique orientation and positioning. This asymmetry ensures that the IC can only be placed in the correct orientation, achieving high placement precision even during manual assembly without specialized machinery.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS7851255B2Placement of an integrated circuit
Publication Date: 2010.12.14 RUSZOWSKI CZESLAW ANDRZEJ
  • US7851255B2 patent drawing
  • US7851255B2 patent drawing
  • US7851255B2 patent drawing

AI summary

Disclosed herein is a method of positioning and placing an integrated circuit on a printed circuit board. The integrated circuit comprises first geometrical elements. The first geometrical elements are of one or more predefined shapes and are located on one or more predefined surfaces of the integrated circuit. The printed circuit board comprises second geometrical elements. The second geometrical elements are shaped to accommodate the first geometrical elements. The first geometrical elements are designed to fit into the second geometrical elements. The first geometrical elements are positioned and placed over the second geometrical elements. The first geometrical elements come in contact with the second geometrical elements at two or more points. The positioning and placement of the first geometrical elements over the second geometrical elements limits displacement of connections of the integrated circuit from the printed circuit board.