Automated IC Handler with Image Sensor for Socket Lid Manipulation
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Solution Overview
Problem
Existing handlers for integrated circuit testing are unable to automate the opening and closing of various socket types, require manual intervention for error detection and correction, and are limited by thermal testing equipment, leading to inefficiencies and reduced testing capacity.
Innovation Solution
A handler equipped with a finger and image sensor system that can automatically pick up, orient, and place integrated circuits, detect and correct orientation, rotation, and tilt errors, and manipulate socket lids without human intervention, using pre-recorded sequences and tools to mimic human actions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual intervention is used to open and close socket lids and handle integrated circuits, then the testing process can be supervised and corrected for errors, but the testing speed and capacity are reduced due to human operator involvement
Solution Approach 1:
The handler system performs self-service by automatically detecting errors through the image sensor and correcting them through automated manipulation of integrated circuits and socket lids, eliminating the need for human operators to manually intervene while maintaining error detection and correction capabilities
Solution Approach 2:
The patent replaces the mechanical human operator system with an automated handler system equipped with image sensors and manipulation tools, substituting human visual inspection and manual correction with automated optical detection and mechanical execution to simultaneously improve speed and maintain reliability
2Productivity
If existing handlers are used for automated testing, then testing capacity is improved, but they remain unable to open and close various socket types and detect/correct errors without manual intervention
Solution Approach 1:
The handler is designed with multi-functionality to perform multiple tasks including picking up integrated circuits, orienting them, placing them in sockets, opening and closing various types of socket lids, and detecting errors through image sensors, making it adaptable to different socket types and testing scenarios without requiring manual intervention
Solution Approach 2:
The handler employs dynamic manipulation capabilities with movable fingers and tools that can adapt to different socket types and integrated circuit orientations, allowing it to handle various socket configurations and perform complex sequences of operations automatically
3Temperature
If thermal testing equipment is used, then environmental testing capability is provided, but it blocks overhead access to the testing socket limiting handler operation
Solution Approach 1:
The patent transitions the handler's approach from overhead access (vertical dimension) to lateral or side access (horizontal dimension), allowing the handler to operate around or alongside thermal testing equipment rather than being blocked by it, thereby maintaining both environmental testing capability and automated manipulation capability
Data Source
AI summary
Apparatuses and methods are disclosed for handling integrated circuits in automated testing. The handler apparatus includes an upper assembly that is selectively translatable above a testing surface and a lower bracket extending from and positioned below the upper assembly. The lower bracket forms a first opening, is selectively moveable upward and downward, and includes a rotatable finger extending downward to pick up and place an integrated circuit in a socket. The handier may further include an image sensor to detect potential error conditions, and a tool extending from the lower bracket to open and close a lid on the socket. The methods include sensing an image of an integrated circuit during certain phases of testing, analyzing the image to determine if the integrated circuit is positioned correctly, and correcting any detected error conditions before continuing with the automated testing.