Integrated Circuit Heat Dissipation Device with Calibrated Compressive Force
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for applying compressive force to integrated circuit (IC) packages in computing devices often fail to provide a consistent and optimal force, risking electrical instability or mechanical damage, while also needing to dissipate heat effectively.
Innovation Solution
A method and apparatus that utilize a spring plate and actuation screw to apply a specified compressive force to an IC package by preventing the actuation screw from being tightened beyond a pre-set mechanical constraint, ensuring a calibrated compressive force is maintained through a combination of spring plate and spring rod deflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation device is used to dissipate heat from the IC, then heat dissipation is improved, but the device cannot apply a consistent and optimal compressive force, risking electrical instability or mechanical damage
Solution Approach 1:
A compressive force application mechanism is introduced as an intermediary between the heat dissipation device and the IC package. This mechanism includes a first element (such as a spring or elastic component) and a second element (such as a clamp or pressure arm) that work together to apply and maintain the required compressive force, thereby ensuring electrical stability while allowing the heat dissipation device to perform its thermal management function
Solution Approach 2:
The system is divided into functionally independent segments: the heat dissipation device for thermal management, and a separate compressive force application mechanism for electrical stability. This segmentation allows each component to optimize its specific function without compromising the other, resolving the contradiction between heat dissipation and electrical stability
2Reliability
If compressive force is increased to hold the IC package in place, then electrical stability is improved, but mechanical damage or electrical shorting may occur
Solution Approach 1:
The compressive force application mechanism uses adjustable parameters (such as spring pre-load, elastic component deformation, or clamp pressure) to precisely control the magnitude of the applied force. By changing these parameters within an optimal range, the system achieves sufficient electrical stability while preventing mechanical damage or electrical shorting
Solution Approach 2:
The mechanism incorporates compliant elements (springs, elastomers, or flexible components) that act as cushions before excessive force can be applied. These elements deform to absorb excess energy and prevent the transmission of damaging forces to the IC package, while still maintaining the necessary compressive force for electrical contact
3Object-affected harmful factors
If compressive force is decreased to prevent mechanical damage, then safety is improved, but electrical stability at the contact interface is compromised
Solution Approach 1:
The compressive force application mechanism is designed to self-regulate and automatically maintain the optimal force level. Through the inherent properties of springs, elastic deformation, or mechanical feedback, the system automatically adjusts to provide sufficient compressive force for electrical stability while inherently limiting the maximum force to prevent mechanical damage, eliminating the need for external monitoring or adjustment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures a consistent and optimal compressive force is applied to the IC package, enhancing electrical stability and heat dissipation while preventing mechanical damage, with the force being within a specified range to avoid electrical shorting or excessive stress.
Implementation Method 1
a spring plate and spring rod assembly collectively deflecting a specified distance when a specified compressive force is applied
Implementation Method 2
the spring plate and spring rod assembly collectively deflecting a specified distance when a specified compressive force is applied
Implementation Method 3
heatsinks are frequently utilized to dissipate heat from the IC and keep the IC functioning properly
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.