Heat Dissipation Enclosure for IC Package Thermal Management
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Solution Overview
Problem
Current integrated circuit packages face challenges in cost-effective thermal management due to the limitations of molded plastic epoxy and conventional heat slug technologies, which fail to adequately dissipate heat, leading to performance degradation and reliability issues in densely packed electronic devices.
Innovation Solution
The integration of a heat block ring and heat slug with a die paddle forms a heat dissipation enclosure around the integrated circuit die, utilizing thermally conductive materials like copper to create efficient thermal paths and reduce thermal resistance, while maintaining the same package outline and substrate material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If molded plastic epoxy (EMC) is used for package protection, then manufacturing cost is reduced and ease of manufacture is improved, but thermal performance deteriorates due to poor heat dissipation properties
Solution Approach 1:
The package is segmented into distinct functional zones: a central heat dissipation path using copper heat slug and heat block ring, surrounded by EMC for protection. This segmentation allows each material to perform its optimal function - copper for thermal conduction and EMC for protective encapsulation - resolving the contradiction between ease of manufacture and thermal performance.
Solution Approach 2:
Different materials are applied to different regions of the package: high thermal conductivity copper is placed locally at the heat generation area (under and around the die), while lower cost EMC is used in non-critical regions. This local quality approach maintains cost-effectiveness while dramatically improving thermal performance where it matters most.
2Device complexity
If conventional heat slug technology is used, then manufacturing complexity is reduced, but thermal performance improvement is limited to only 15% over PBGA packages
Solution Approach 1:
The invention merges multiple heat dissipation mechanisms into a unified structure: a copper heat slug at the center, surrounded by a copper heat block ring, both embedded in the EMC. This combination creates multiple parallel thermal conduction paths, significantly improving heat dissipation capability while maintaining manufacturing feasibility through integration into the molding process.
Solution Approach 2:
The package employs a composite material structure combining copper (high thermal conductivity) and epoxy molding compound (protective, cost-effective). The copper components are strategically positioned to create efficient thermal pathways, while the EMC provides structural protection and electrical insulation. This composite approach achieves superior thermal performance without proportionally increasing manufacturing complexity.
3Productivity
If integrated circuits are densely packed to reduce footprint and cost, then manufacturing cost and device density are improved, but heat generation increases leading to performance degradation and reliability issues
Solution Approach 1:
The copper heat slug and heat block ring act as thermal intermediaries between the integrated circuit die and the external environment. These intermediary structures provide low thermal resistance pathways that efficiently conduct heat away from the dense circuit packaging, enabling high device density while maintaining reliability through effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances thermal, electrical, and reliability performance by efficiently dissipating heat through the heat block ring and heat slug, reducing the volume of low-conductivity mold compound and increasing the thermal conductivity of the package, thus improving heat transfer and maintaining cost-effectiveness.
Implementation Method 1
attaching a heat slug on the heat block ring over the integrated circuit die
Implementation Method 2
enhance the ability of heat being dissipated to the package ambient environment
Data Source
AI summary
An integrated circuit package system is provided providing an integrated circuit die, and enclosing the integrated circuit die in a heat dissipation enclosure comprises mounting the integrated circuit die on a die paddle attaching a heat block ring to the die paddle around the integrated circuit die, and attaching a heat slug on the heat block ring over the integrated circuit die.