Integrated Circuit Heating Circuit for Targeted Temperature Testing

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Solution Overview

Problem

Conventional IC testing methods require dedicated heating equipment and take a long time to heat and cool the entire IC, increasing testing time and complexity.

Innovation Solution

An IC with a built-in heating circuit that receives a heating signal to heat specific portions of the target circuit to predetermined temperatures, allowing for efficient testing without heating the entire IC.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If dedicated heating equipment is used to heat the entire IC, then the IC can be tested at higher temperatures, but the testing time and equipment complexity increase significantly

Engineering Contradiction:

ImproveIC testing temperatureVSAvoidtesting time

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

The patent divides the IC into a target circuit portion and a heating circuit portion. The heating circuit is specifically designed to heat only the target circuit area, rather than heating the entire IC. This segmentation allows for localized heating that reduces the time required to reach testing temperature while maintaining the ability to test at higher temperatures.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heating circuit is pre-integrated into the IC package during manufacturing, rather than using external heating equipment during testing. This preliminary preparation of the heating capability within the IC structure eliminates the need for external heating equipment and reduces setup time, allowing immediate heating of the target circuit when testing is required.

Inventive Principle:

Principle #10Preliminary action

2Temperature

If dedicated heating equipment is used to heat the entire IC, then the IC can be tested at higher temperatures, but the equipment complexity and cost increase

Engineering Contradiction:

ImproveIC testing temperatureVSAvoidtesting equipment complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the heating function with the IC structure itself by integrating a heating circuit within the package. This combination eliminates the need for separate external heating equipment, reducing overall system complexity while maintaining the capability to heat the target circuit to required testing temperatures.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heating circuit integrated into the IC serves multiple purposes: it can heat the target circuit to various temperatures for different testing requirements, and it is already part of the IC structure so no additional external heating equipment is needed. This multi-functionality reduces both equipment complexity and cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If the entire IC is heated, then the target circuit can be tested at higher temperatures, but the heating time is prolonged

Engineering Contradiction:

Improvetarget circuit temperatureVSAvoidheating time

Core Design Contradiction:

TemperatureVSDuration of action of moving object

Solution Approach 1:

The heating circuit is designed to provide localized heating specifically to the target circuit area, with different heating characteristics for different regions. The heating portion is positioned adjacent to the target circuit and configured to heat primarily that area, reducing the thermal mass that needs to be heated and thereby reducing the time to reach testing temperature.

Inventive Principle:

Principle #3Local quality

4Reliability

If the entire IC is heated and then cooled for subsequent tests, then temperature-related testing can be performed, but the overall testing cycle time increases

Engineering Contradiction:

Improvetemperature testing reliabilityVSAvoidtesting efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

By segmenting the IC into a target circuit and a heating circuit, and by positioning the heating circuit to affect primarily the target circuit area, the patent enables faster heating and cooling cycles. This segmentation allows temperature-related testing to be performed reliably on the target circuit while reducing the overall thermal mass involved, thereby improving testing efficiency and productivity.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces IC testing time, complexity, and cost by enabling targeted heating and simultaneous testing of other circuits during cooling.

Implementation Method 1

a heating circuit, configured to receive a heating signal to heat at least a testing portion of the target circuit to a first predetermined temperature

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20240329119A1Integrated circuit and integrated circuit testing method

Publication Date: 2024.10.03 REALTEK SEMICON CORP

AI summary

An IC, comprising: a package; a target circuit; and a heating circuit, configured to receive a heating signal to heat at least testing portion of the target circuit to a first predetermined temperature based on the heating signal. The target circuit and the heating circuit are within the package. An IC testing method using such IC is also disclosed.