IC Heating Element Layout for Uniform Chip Heat Dissipation
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Solution Overview
Problem
Existing integrated circuit devices experience heat bias and uneven heat distribution due to the arrangement of heating elements, leading to potential malfunctions and assembly challenges.
Innovation Solution
The integrated circuit device incorporates a heating element with a specific outer shape and arrangement, where the distance between the long side of the heating element and one side of the circuit is greater than the distance between the short side and another side, enhancing heat dissipation and reducing heat accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heating element is arranged without considering its shape and orientation, then the circuit device can be manufactured quickly, but heat bias and uneven heat distribution occur inside the chip
Solution Approach 1:
The heating element is designed with an asymmetric rectangular shape having distinct long and short sides, and is positioned at an asymmetric location on the chip where the distance from the long side to one chip side exceeds the distance from the short side to the adjacent chip side. This asymmetric arrangement creates optimal heat dissipation pathways in multiple directions, preventing heat bias and ensuring uniform temperature distribution across the chip.
2Temperature
If the heating element is placed closer to chip edges for better heat dissipation, then heat bias is reduced, but the area available for other circuit components decreases
Solution Approach 1:
The heating element is positioned at a specific location on the chip where the asymmetric arrangement optimizes heat dissipation without excessively compromising the available area. The long side of the heating element is oriented such that the distance to one chip side is greater than the distance from the short side to the adjacent chip side, creating balanced heat dissipation pathways while preserving sufficient space for other circuit components in the remaining chip area.
3Reliability
If the heating element has a symmetric shape and central placement, then manufacturing is simplified, but local heat accumulation occurs causing malfunctions
Solution Approach 1:
The heating element employs an asymmetric rectangular configuration with distinct long and short sides, positioned off-center on the chip. The specific arrangement ensures that the distance from the long side to one chip side exceeds the distance from the short side to the adjacent chip side. This asymmetric design prevents local heat accumulation by creating multiple heat dissipation pathways, thereby improving reliability and preventing malfunctions caused by overheating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement improves heat dissipation and prevents local heat bias, allowing for efficient heat distribution and quicker detection of overheating states, thereby reducing the risk of malfunctions.
Implementation Method 1
a distance between the long side of the heating element and a first side of the integrated circuit device is larger than a distance between the short side of the heating element and a second side of the integrated circuit device
Data Source
AI summary
An integrated circuit device includes a heating element, and a control circuit configured to control flow of a current through the heating element. An outer shape of the integrated circuit device has a first side and a second side intersecting the first side. An outer shape of the heating element has a short side and a long side. A distance between the long side of the heating element and the first side of the integrated circuit device is larger than a distance between the short side of the heating element and the second side of the integrated circuit device.