Integrated Circuit Hot Spot Detection for Targeted Thermal Throttling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat control systems for configurable integrated circuits lack detailed temperature profiling and power management, leading to widespread performance throttling and inefficiency due to the inability to identify and address specific hot spots accurately.
Innovation Solution
A thermal management controller in the integrated circuit uses thermal coefficients calculated during synthesis to dynamically identify hot spots and adjust power management strategies, including fan speed and power reduction, based on real-time temperature sensor data and power versus temperature curves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If uniform power density is used for heat control, then the entire IC performance is reduced to manage die temperature, but this causes excessive performance loss when only localized hot spots need cooling
Solution Approach 1:
The patent applies local quality by transitioning from uniform power density control to non-uniform power management. The system identifies specific hot spots through temperature profiling and applies power reduction only to the circuit blocks generating excessive heat, while allowing other regions to operate at full power. This is achieved through the thermal management controller that receives temperature data, identifies hot spots, and selectively adjusts power to specific circuit blocks based on their thermal contribution.
2Measurement precision
If detailed temperature profiling and hot spot identification are implemented, then targeted thermal mitigation is achieved, but this increases device complexity
Solution Approach 1:
The patent applies preliminary action by performing temperature profiling and hot spot identification during the synthesis phase before the IC is deployed. The synthesis tool generates a temperature map and identifies potential hot spots in advance, storing this information for use during operation. This preliminary analysis allows the thermal management controller to have pre-computed data about circuit block thermal characteristics, enabling faster and more accurate real-time power management decisions without requiring complex runtime analysis.
Solution Approach 2:
The patent uses a synthesized temperature map as a computational copy or model of the actual thermal distribution. Instead of continuously measuring every point on the IC die in real-time, the system uses the pre-computed temperature map generated during synthesis to understand thermal patterns. This copy allows the system to make intelligent power management decisions based on simulated thermal behavior, reducing the complexity of real-time measurement and control systems.
3Ease of operation
If thermal management relies on external board management controllers, then centralized control is achieved, but this increases loss of information about internal circuit block temperatures
Solution Approach 1:
The patent applies self-service by embedding the thermal management controller directly within the IC architecture, allowing the IC to autonomously monitor and manage its own thermal state. The controller has direct access to temperature sensor data from various circuit blocks and can independently identify hot spots and adjust power without requiring external intervention. This self-service capability eliminates information loss that would occur with external controllers while maintaining centralized control logic within the IC itself.
Data Source
AI summary
An integrated circuit includes temperature sensors that generate temperature sensor data indicating temperatures in the integrated circuit, a thermal management controller circuit that identifies at least one hot spot in at least one location that is different from locations of the temperature sensors using the temperature sensor data and thermal coefficient data, and a power management controller circuit that decreases power of at least one circuit block corresponding to the at least one hot spot in a circuit design for the integrated circuit to reduce a temperature of the at least one hot spot.