Integrated Circuit Housing with Thermal Expansion Matching

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Solution Overview

Problem

Existing integrated circuit components face reliability issues due to mismatches in coefficients of thermal expansion between the chip and the carrier plate, leading to mechanical stress and potential detachment during temperature fluctuations, especially in large packages with high switching currents.

Innovation Solution

A housing arrangement with a multiplicity of contact devices arranged in a series, an intermediate zone without contact devices, and a wiring device overlapping the housing body, which allows for larger distances between contact elements and matching thermal expansion coefficients between the housing body and the carrier plate, reducing mechanical stress and enhancing thermomechanical reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If contact devices are arranged in a multiplicity at the wiring device, then the number of external contacts increases, but the reliability decreases due to mechanical stress from thermal expansion mismatches

Engineering Contradiction:

Improvenumber of external contactsVSAvoidreliability of contact devices

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The housing body serves as an intermediary element between the integrated circuit and the carrier plate. By matching its thermal expansion coefficient to that of the carrier plate, it mediates the thermal stress that would otherwise be transmitted to the contact devices, thereby maintaining reliability while supporting a multiplicity of contacts

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the thermal expansion parameter by selecting housing body materials with specific thermal expansion coefficients that match the carrier plate. This parameter adjustment eliminates the root cause of mechanical stress, allowing reliable operation with multiple contact devices

Inventive Principle:

Principle #35Parameter changes

2Power

If the component package is made large to accommodate high switching currents, then the power handling capability increases, but the mechanical stress increases due to thermal expansion mismatches

Engineering Contradiction:

Improveswitching current capabilityVSAvoidmechanical stress

Core Design Contradiction:

PowerVSStress or pressure

Solution Approach 1:

The patent adjusts the thermal expansion parameter of the housing body to match the carrier plate, thereby eliminating mechanical stress even in large packages designed for high switching currents. This allows power handling capability to increase without proportionally increasing mechanical stress

Inventive Principle:

Principle #35Parameter changes

3Area of stationary object

If contact devices are arranged closely to maximize space utilization, then the area efficiency increases, but the distance between contact elements must be reduced

Engineering Contradiction:

Improvearea efficiency of contact arrangementVSAvoiddistance between contact elements

Core Design Contradiction:

Area of stationary objectVSLength of moving object

Solution Approach 1:

The housing body acts as a stress-absorbing intermediary that decouples the contact devices from thermal expansion mismatches. This allows contact elements to be arranged with optimal spacing for area efficiency without compromising reliability, as the housing body protects against thermal stress regardless of contact density

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces mechanical stress and improves the reliability of contact devices by matching thermal expansion coefficients and optimizing the arrangement of contact devices, ensuring reliable connections even under temperature fluctuations.

Implementation Method 1

matching thermal expansion coefficients between the housing body and the carrier plate, reducing mechanical stress

Methodology Applied

Scientific EffectThermal expansion matching: Thermal Expansion

Implementation Method 2

mismatches in coefficients of thermal expansion between the chip and the carrier plate, leading to mechanical stress and potential detachment during temperature fluctuations

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

an intermediate zone without contact devices, and a wiring device overlapping the housing body, which allows for larger distances between contact elements and matching thermal expansion coefficients

Methodology Applied

Scientific EffectStress distribution:

Data Source

PatentUS8742563B2Component and method for producing a component

Publication Date: 2014.06.03 INTEL CORP

AI summary

A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the integrated circuit and the housing body, and one or more external contact devices in communication with the wiring device.