Integrated Circuit Image Sensor for Wheel Alignment

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Solution Overview

Problem

Existing image-based wheel alignment systems have components that are not fully integrated into a single chip, leading to inefficiencies and the need for separate, discreet circuit boards, which increases cost and complexity.

Innovation Solution

An integrated circuit that includes an image sensor, a programmable controller, and multiple interfaces for data communication and control signaling, allowing for the integration of various functions such as brightness control, cooling, indicator operation, and camera positioning, all on a single chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If components are implemented with functionally discreet components on large circuit boards, then ease of manufacture is improved, but device complexity increases and cost increases

Engineering Contradiction:
Improveease of manufactureVSAvoiddevice complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent integrates multiple previously separate components (image sensor, A/D converter, signal conditioning circuitry, sensor control logic, and processor) onto a single integrated circuit chip. This merging eliminates the need for large circuit boards with multiple discreet components, thereby reducing device complexity while maintaining manufacturability through standard semiconductor fabrication processes.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated circuit performs multiple functions that were previously handled by separate components: image capture, analog-to-digital conversion, signal conditioning, sensor control, and image processing. This multi-functionality on a single chip reduces the overall system complexity and component count while improving integration efficiency.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If multiple functions are integrated on a single chip, then device complexity is reduced and cost is lowered, but manufacturing precision requirements increase

Engineering Contradiction:
Improvedevice complexityVSAvoidmanufacturing precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent combines multiple functional blocks (sensor array, A/D converter, signal conditioning circuitry, control logic, and processor) into a single integrated circuit using standard semiconductor fabrication techniques. This approach maintains manufacturing precision by utilizing established CMOS or similar process technologies that can reliably integrate diverse functions on one chip without requiring exotic high-precision manufacturing methods.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7855783B2Integrated circuit image sensor for wheel alignment systems
Publication Date: 2010.12.21 SNAP ON INC
  • US7855783B2 patent drawing
  • US7855783B2 patent drawing
  • US7855783B2 patent drawing

AI summary

An integrated circuit (IC), for use in an imaging module of a wheel alignment system, incorporates an image sensor as well as a number of other features. Some of the added features are implemented within the integrated circuit. The IC also incorporates interfacing for signaling or communication with other devices in the imaging module or elsewhere in the wheel alignment system. Some examples of added internal features include a temperature sensor, unique chip ID, and chip power control. The addition of analog and/or digital I/O to the integrated circuit enables control of an image module illumination function, control of an imaging module positioning function, various cooling functions, and operator interface control. A communications hub may be added to the IC, to enable operation in a networked system environment.