Nondestructive IC Imaging via Coded Aperture and Computational Reconstruction
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Solution Overview
Problem
Current methods for imaging complex 3D structures like integrated circuits (ICs) face challenges such as the need for destructive processes, high costs, and long timescales, particularly with synchrotrons, and lack non-destructive high-resolution imaging capabilities within a reasonable timeframe.
Innovation Solution
A tabletop system utilizing an electron beam generator with two modes of operation (E-mode and X-mode) for non-destructive imaging, employing electron detectors and spectral X-ray detectors to achieve high-resolution imaging of ICs without X-ray lenses, allowing for precise positioning and error correction using interferometric and capacitive sensors, enabling imaging within a month or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If synchrotron-based imaging is used to achieve high-resolution imaging of IC structures, then imaging resolution is improved, but imaging time and cost increase significantly
Solution Approach 1:
The patent introduces a specialized target structure with periodic patterns and varying thickness as an intermediary between the X-ray source and the IC sample. This target modulates the X-ray beam to encode structural information, enabling high-resolution imaging through computational reconstruction rather than direct imaging, thereby reducing imaging time while maintaining resolution
Solution Approach 2:
The patent replaces the mechanical/optical imaging system (X-ray lenses and direct detection) with a computational imaging system. Instead of using complex optical components to focus and image X-rays directly, the system uses a coded aperture target and computational algorithms to reconstruct the IC structure from transmitted X-ray intensity measurements, significantly reducing imaging time
2Measurement precision
If traditional X-ray imaging systems with lenses are used, then imaging capability is improved, but system complexity and cost increase
Solution Approach 1:
The patent extracts and removes the complex X-ray lens system from the imaging pathway. Instead of using lenses to focus and form images, the system uses a coded aperture target that modulates the X-ray beam, allowing image reconstruction through computational methods without requiring complex optical components
Solution Approach 2:
The patent creates a computational copy of the IC structure through algorithmic reconstruction rather than direct optical imaging. The target structure encodes spatial information about the IC, and computational algorithms reconstruct the 3D structure from the transmitted intensity patterns, replacing the need for complex physical imaging optics
3Measurement precision
If destructive imaging processes are used to image IC structures, then imaging precision is improved, but sample integrity is compromised
Solution Approach 1:
The patent replaces destructive mechanical or chemical etching processes with non-destructive X-ray transmission imaging. The system uses a coded aperture target and computational reconstruction to achieve high-resolution imaging of IC structures without physically altering or destroying the sample, maintaining both precision and sample integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides high-resolution imaging of ICs with features as small as 10 nm, is cost-effective, and operates non-destructively, overcoming the limitations of existing techniques by enabling rapid and accurate characterization of IC structures.
Implementation Method 1
A tabletop system utilizing an electron beam generator with two modes of operation (E-mode and X-mode) for non-destructive imaging
Implementation Method 2
allowing for precise positioning and error correction using interferometric and capacitive sensors
Data Source
AI summary
A system and method for imaging a sample having a complex structure (such as an integrated circuit). The sample is placed on a motion system that moves the sample with respect to an electron beam generator that is used in imaging the sample. The motion system affords thirteen degrees-of-freedom for movement of the sample, by providing a rotation stage, a fine 6-axis piezoelectric-driven stage, and a coarse 6-axis hexapod stage. Various detectors gather information to image the sample. Interferometric and/or capacitive sensors are used to measure the position of the sample and motion system.