IC Inductors with Angular Magnetic Field Orientation
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Solution Overview
Problem
Conventional IC inductors suffer from high parasitic effects and unwanted magnetic coupling, leading to noise and interference in compact communication systems, and occupy a large area on IC substrates, necessitating a reduction in coupling without increasing physical spacing.
Innovation Solution
The use of directional electromagnetic emission IC inductors, where each inductor element has a specific magnetic field direction, allowing them to be oriented at a non-zero angle relative to each other to reduce magnetic coupling, thereby minimizing interference and area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional spiral inductors are used in compact communication systems, then inductors can be integrated on-chip, but magnetic coupling between adjacent inductors causes unwanted interference signals
Solution Approach 1:
The patent applies asymmetry by orienting adjacent inductors at non-zero angles relative to each other rather than using conventional symmetric parallel alignment. This asymmetric angular orientation causes the magnetic field vectors to diverge, reducing magnetic coupling and interference between adjacent inductors while maintaining on-chip integration capability
Solution Approach 2:
The patent transitions from two-dimensional planar inductor layout to three-dimensional angular orientation by introducing vertical stacking with angular offsets between layers. This dimensional change allows inductors to be positioned closer together while maintaining reduced magnetic coupling through spatial separation in the vertical dimension
2Object-affected harmful factors
If physical spacing between inductors is increased to reduce magnetic coupling, then interference is reduced, but the required area of IC substrate increases
Solution Approach 1:
The patent resolves this contradiction by moving from horizontal spacing to vertical stacking with angular orientation. Inductors are placed in different layers with angular offsets, achieving magnetic coupling reduction without increasing the horizontal footprint on the IC substrate, thus maintaining compact area usage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces magnetic coupling between adjacent IC inductors, enhancing isolation and performance in multi-channel circuits without increasing physical spacing, thus reducing the required area and cost of IC substrates.
Implementation Method 1
The first inductor element has a first effective magnetic field direction associated therewith, and the second inductor element has a second effective magnetic field direction associated therewith
Data Source
AI summary
An IC inductor structure is provided which includes a first inductor element formed on a semiconductor substrate and at least a second inductor element formed on the semiconductor substrate proximate the first inductor element. The first inductor element has a first effective magnetic field direction associated therewith, and the second inductor element has a second effective magnetic field direction associated therewith. The first and second inductor elements are oriented relative to one another so as to create a non-zero angle between the first and second effective magnetic field directions.