Selective Cuts for IC Interconnect Bulging Prediction
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Solution Overview
Problem
In the fabrication of integrated circuits (ICs), maintaining the fidelity of interconnect structures at small sizes is challenging due to effects like proximity and edge effects, leading to bulging at the ends of interconnect structures, which can result in undesirable dumbbell-shaped profiles and increased risk of unwanted contact between adjacent structures.
Innovation Solution
A computer-implemented method and system that applies a bulging prediction analysis to IC designs to identify regions likely to experience end-region bulging, determines the parameters for selective cuts to remove these bulges without affecting non-affected regions, and updates the CAD file to include these cuts, ensuring the interconnect structures meet the required dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If interconnect structures are fabricated at small sizes, then device density and integration are improved, but proximity and edge effects cause bulging that deforms the interconnect shape
Solution Approach 1:
The system performs bulging prediction analysis on the IC design before fabrication to identify interconnect structures that will experience excessive bulging. Based on this prediction, the system proactively modifies the design by adding selective cuts to remove the bulging portions before the actual fabrication process begins, thereby preventing the shape deformation from occurring in the first place.
Solution Approach 2:
The system changes the geometric parameters of the interconnect structures by adding selective cuts at specific locations predicted to experience bulging. This modification alters the physical dimensions and shape of the interconnects in the design, compensating for the expected fabrication-induced deformations and maintaining the intended shape fidelity after manufacturing.
2Shape
If selective cuts are added to remove bulging regions, then interconnect shape fidelity is improved, but CAD file complexity and processing time increase
Solution Approach 1:
Instead of applying uniform modifications to all interconnect structures, the system performs localized modifications only at specific locations where bulging is predicted to occur. The selective cuts are added only to the interconnect structures that meet the bulging criteria, leaving other structures unchanged. This localized approach minimizes the overall increase in CAD file complexity while still achieving the desired shape fidelity improvement.
3Manufacturing precision
If selective cuts are added to remove bulging regions, then manufacturing precision is improved, but fabrication process complexity increases
Solution Approach 1:
The system incorporates the selective cuts into the IC design before fabrication, so that the modified design with bulge-removal cuts is what gets manufactured. This preliminary modification approach actually simplifies the fabrication process by eliminating the need for additional post-fabrication processing steps to correct bulging, as the cuts are already built into the design that guides the manufacturing process.
Data Source
AI summary
Embodiments of the invention are directed to a computer system having a processor communicatively coupled to a memory. The processor performs processor operations that include accessing an electronic file that includes an electronic integrated circuit (IC) design. The electronic file is operable to control a fabrication system to fabricate an IC according to the electronic IC design. The processor operations further includes applying a bulging predication analysis to the electronic IC design; and making one or more changes to the electronic IC design based at least in part on a result of the bulging prediction analysis.