Integrated Circuit Interconnects with Extended Conductive Levels
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Solution Overview
Problem
Conventional integrated circuit arrangements with damascene architecture face limitations in achieving high-quality passive components due to restricted interconnect cross-sections, leading to suboptimal electrical properties and increased resistance, which hinders the production of coils with high quality factors and capacitors with low contact resistance.
Innovation Solution
The integration of three successive conductive structure levels with wiring interconnects that extend along their entire length, eliminating the need for via levels and utilizing single damascene architecture to enable current transport both vertically and laterally, thereby increasing interconnect cross-sections and reducing resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional damascene architecture with via levels is used, then vertical current transport is enabled, but interconnect cross-section is restricted and resistance increases
Solution Approach 1:
The patent merges via levels and interconnect levels into unified conductive structure levels. Conductive structures in these levels serve dual functions: they provide lateral current transport as interconnects and vertical current transport as vias to adjacent levels, eliminating the need for separate via levels and improving electrical properties through larger effective cross-sections
Solution Approach 2:
Conductive structures in the successive conductive structure levels are designed to perform multiple functions simultaneously. Each conductive structure acts as both an interconnect for lateral current transport within its level and as a via for vertical current transport to adjacent levels, thereby reducing overall structure complexity while maintaining reliable electrical connections
2Ease of manufacture
If via levels are eliminated and wiring interconnects extend along entire length, then manufacturing process is simplified, but current transport requirements must be met
Solution Approach 1:
The patent segments current transport into three successive conductive structure levels, each containing conductive structures that handle both lateral and vertical current components. This segmentation allows the elimination of discrete via levels while maintaining precise current transport paths through the distributed conductive structures across multiple levels
Solution Approach 2:
The patent transitions from a two-dimensional planar interconnect structure with separate via levels to a three-dimensional structure where conductive structures extend through multiple successive levels. This dimensional change enables current transport in both lateral and vertical directions within the same conductive structures, simplifying manufacturing while meeting precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in higher current densities, reduced Joule heating, and the ability to produce passive components with improved quality factors and low series resistance, while simplifying the manufacturing process and reducing costs by minimizing the need for discrete vias and complex via etching.
Implementation Method 1
The conductive structures each contain at least one bottom area near to the substrate and a top area remote from the substrate... serve for vertical current transport... for lateral current transport
Implementation Method 2
reduced Joule heating
Data Source
AI summary
An integrated circuit arrangement is disclosed. In one embodiment, the integrated circuit arrangement includes at least three conductive structures levels and elongated interconnects.