Integrated Circuit Icc Current Temperature Scaling Factor Estimation
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Solution Overview
Problem
Current methods for estimating Icc current temperature scaling factor in integrated circuits are inaccurate and time-consuming, especially at high temperatures, due to variations in transistor characteristics and the difficulty of measuring Icc current at high temperatures.
Innovation Solution
A method is developed to estimate Icc current temperature scaling factor by simulating Icc current at room and high temperatures using transistor characteristics, such as gate current, on current, and off current, and correlating it with propagation delay to accurately predict high-temperature leakage currents based on measurements at room temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If Icc current is measured at high temperatures to create temperature scaling factor, then estimation of high temperature leakage can be achieved, but measurement time increases and cost increases
Solution Approach 1:
The patent applies preliminary action by measuring Icc current at room temperature (25°C) before high temperature conditions, and using these preliminary measurements to calculate the temperature scaling factor through modeling. The room temperature measurements serve as the basis for predicting high temperature behavior without actually performing time-consuming high temperature measurements, thus resolving the contradiction between accuracy and measurement time.
2Measurement precision
If Icc current is measured at high temperatures to create temperature scaling factor, then estimation of high temperature leakage can be achieved, but measurement cost increases
Solution Approach 1:
The patent performs preliminary measurements at room temperature where standard testers can operate within their measurement limits, avoiding the need for expensive high temperature measurement equipment and facilities. The room temperature Icc measurements are used to build models that predict high temperature behavior, significantly reducing measurement costs while maintaining estimation accuracy.
Solution Approach 2:
The patent creates a mathematical model that copies or replicates the high temperature Icc current characteristics based on room temperature measurements. Instead of directly measuring at high temperatures, the model generates equivalent high temperature behavior from lower temperature data, reducing the need for expensive high temperature testing infrastructure.
3Measurement precision
If Icc current measurement is performed at high temperatures, then high temperature leakage characteristics can be obtained, but measurement limits are exceeded due to high current values
Solution Approach 1:
The patent performs preliminary measurements at room temperature where Icc current values are within the measurement capabilities of standard testers. These preliminary room temperature measurements are then used to calculate temperature scaling factors and build predictive models, avoiding the infeasibility of directly measuring the excessively high currents that occur at high temperatures.
Solution Approach 2:
The patent changes the temperature parameter from high temperature (where measurement is infeasible) to room temperature (where measurement is feasible). By measuring at room temperature and then applying temperature scaling factors to predict high temperature behavior, the patent transforms an infeasible measurement problem into a feasible one while still obtaining the desired high temperature characteristics.
4Productivity
If fitting curves with different origins are used to estimate ITSF, then measurements can be performed, but estimation accuracy deteriorates
Solution Approach 1:
The patent performs preliminary measurements and curve fitting at room temperature where all devices can be characterized under uniform conditions. The room temperature fitting curves serve as the foundation for calculating temperature scaling factors, eliminating the problem of different curve origins that would arise from fitting at different temperatures. This preliminary characterization at a common reference temperature ensures consistent and accurate ITSF estimation.
Data Source
AI summary
An embodiment of the present invention reduces resources needed to estimate the Icc Current Temperature Scaling Factor (ITSF) of a device, and provides a method and apparatus to estimate ITSF from the device speed and performance characteristics which can be measured at room temperature. In one embodiment, a method for estimating the ITSF of an integrated circuit includes: determining a level of propagation delay of a portion of the integrated circuit; and determining an estimated Icc current temperature scaling factor from a correlation between the level of the propagation delay and a modeled Icc current temperature scaling factor.