IC Layout Illustration Generator for 3D Layer and Region Views
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Solution Overview
Problem
Current IC design software limits illustrations to single two-dimensional views with low granularity, failing to indicate layer heights or device regions, thus reducing their usefulness in predicting performance.
Innovation Solution
A system and method for generating two-dimensional and three-dimensional digital illustrations of user-selected IC layout areas using a regions database, which identifies specific IC component regions and dielectric material regions, allowing for high-granularity views.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If current IC design software generates illustrations, then illustrations can be produced for performance prediction, but the illustrations have low granularity and lack layer height and device region information
Solution Approach 1:
The patent segments the IC layout into multiple discrete layers (first layer, second layer, third layer, etc.) and generates separate illustrations for each layer. This segmentation allows high-granularity representation of layer heights and device regions while maintaining manageable software complexity through systematic processing of individual layers.
Solution Approach 2:
The patent transitions from traditional two-dimensional illustrations to multi-dimensional representations by incorporating layer height information and three-dimensional perspectives. This dimensionality enhancement provides detailed device region information without overwhelming software complexity through algorithmic generation.
2Measurement precision
If detailed layer and region information is included in illustrations, then performance prediction accuracy improves, but processing time and computational resources increase
Solution Approach 1:
The patent performs preliminary actions by pre-processing and organizing layout data into structured layer information before illustration generation. This preparation enables rapid generation of high-granularity illustrations with detailed layer and region information, reducing processing time while maintaining performance prediction accuracy.
3Loss of information
If multiple layer heights and device regions are represented, then illustration detail and usefulness increase, but software complexity and computational load increase
Solution Approach 1:
The patent segments complex multi-layer IC layouts into discrete, manageable layer components (first layer, second layer, third layer, etc.). This segmentation preserves complete information about layer heights and device regions while reducing software complexity through systematic, modular processing of each layer independently.
Solution Approach 2:
The patent changes the representation parameters by introducing layer height values and three-dimensional coordinates for each layer. This parameter enhancement provides complete information about device regions while managing software complexity through standardized parameter structures and algorithms.
Data Source
AI summary
Disclosed are a method, system, and software application (referred to herein as an illustration generator) for generating two or three dimensional (2D or 3D) digital illustrations of user-selected areas of integrated circuit (IC) layouts. The illustration generator can include a program of instructions executable by processor to cause the processor to perform a method. This method includes: generating a database of IC component regions (e.g., using a technology file, and a design manual); comparing a user-selected area of an IC layout to the database in order to identify specific IC component regions included within the user-selected area; and generating a 2D or 3D digital illustration of the area. The digital illustration can include representations of different structural features within the area including at least some of the previously identified specific integrated circuit component regions.