IC Layout Margin Prediction for Structure Compaction
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Solution Overview
Problem
Conventional IC fabrication techniques face challenges in further modifying IC layouts without violating design rules, limiting opportunities for structure compaction and increasing surface area efficiency.
Innovation Solution
A method utilizing a machine learning module and training data to predict margins between adjacent structures in an IC layout, allowing for adjustments that maintain compliance with design rules while reducing separation distances, thereby enabling more compact layouts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional processing techniques are used to manufacture ICs, then design rules are followed, but layout modification opportunities are limited and structure density cannot be increased
Solution Approach 1:
The system performs preliminary margin analysis using machine learning models before final layout decisions are made. By predicting margins between adjacent structures in advance, the system identifies compaction opportunities that maintain design rule compliance, allowing layout modifications to be made before manufacturing without violating constraints
Solution Approach 2:
The system changes the parameter of margin prediction by using machine learning models to estimate margins between adjacent structures. This enables dynamic adjustment of layout parameters (separation distances) while maintaining compliance with design rules, thereby increasing structure density without sacrificing manufacturing precision
2Ease of manufacture
If design rules impose stronger limits on spacing between structures, then manufacturing constraints are satisfied, but surface area efficiency decreases
Solution Approach 1:
The system applies local quality by analyzing margins between specific adjacent structures individually. Instead of uniformly applying design rule limits across the entire layout, the machine learning model predicts margins locally for each pair of adjacent structures, allowing compaction in regions where margins permit while maintaining manufacturability constraints where needed
Solution Approach 2:
The system performs preliminary margin analysis to identify regions where design rules can be satisfied with smaller spacing. By predicting margins before final layout determination, the system can optimize surface area efficiency while ensuring manufacturability is maintained in critical regions
Data Source
AI summary
The disclosure provides a method for the manufacture and layout adjustment of integrated circuits (ICs) with margin analysis. The method includes identifying a design rule applicable to two adjacent structures represented in an integrated circuit (IC) layout. The method also includes predicting, via a machine learning module and an associated library of training data for the IC layout, a margin for the two adjacent structures based on the design rule. From the predicting, the method determines whether the predicted margin is below a threshold margin. In cases where the predicted margin is below the threshold margin, the method includes manufacturing a device from the IC layout. In some implementations, the method includes modifying the IC layout.