IC Layout Partitioning for Manufacturability

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Solution Overview

Problem

The semiconductor manufacturing industry faces challenges in achieving balanced IC design rules that enhance manufacturability without disrupting established design flows, as conventional global design rules struggle with sub-wavelength photolithography, leading to manufacturability issues and reduced yield due to aggressive design requirements.

Innovation Solution

A back-end methodology that applies localized design rules and resolution enhancement techniques (RET) to specific areas of the IC layout, optimizing manufacturability by partitioning the design into granular levels and adjusting rules based on critical layout properties, thereby minimizing global process tolerance and maximizing design density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If aggressive global design rules are applied to achieve tighter IC designs, then design density is improved, but manufacturability deteriorates due to sub-wavelength photolithography limitations

Engineering Contradiction:
Improvedesign densityVSAvoidmanufacturability
Core Design Contradiction:
Area of moving objectVSEase of manufacture

Solution Approach 1:

The patent applies different design rules locally to specific pattern instances rather than using uniform global rules. The system identifies difficult-to-manufacture patterns and applies relaxed design rules only to those specific locations, while maintaining aggressive rules for other areas. This localized approach preserves overall design density while improving manufacturability of critical patterns.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The system dynamically adjusts design rule parameters based on the specific characteristics of each pattern instance. By analyzing pattern complexity and manufacturing difficulty, the system modifies parameters such as minimum feature size and spacing requirements locally, transforming the rigid global design rule approach into a flexible, adaptive system that balances density and manufacturability.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If global design rules are relaxed to improve manufacturability, then ease of manufacture is improved, but design density deteriorates

Engineering Contradiction:
ImprovemanufacturabilityVSAvoiddesign density
Core Design Contradiction:
Ease of manufactureVSArea of moving object

Solution Approach 1:

Instead of relaxing design rules globally, the system identifies specific pattern instances that require relaxed rules for manufacturability. By applying rule modifications only to those localized areas with manufacturing difficulties, the system maintains high design density in the overall design while ensuring manufacturability of critical patterns.

Inventive Principle:
Principle #3Local quality

3Reliability

If localized design rules and RET are applied to optimize manufacturability, then yield is improved, but device complexity increases due to partitioning and rule adjustment

Engineering Contradiction:
ImproveyieldVSAvoiddesign process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the IC design into multiple pattern instances and applies design rules selectively to each segment. The system partitions the design layout to identify difficult patterns and applies appropriate design rules and RET techniques to each segment, improving yield through targeted optimization while managing complexity through systematic segmentation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system automatically analyzes pattern instances, identifies manufacturing difficulties, and applies appropriate design rules and RET techniques without requiring manual intervention for each pattern. This self-service approach improves yield through comprehensive analysis while minimizing the increase in design process complexity by automating the rule application process.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS7523429B2System for designing integrated circuits with enhanced manufacturability
Publication Date: 2009.04.21 APPLIED MATERIALS INC
  • US7523429B2 patent drawing
  • US7523429B2 patent drawing
  • US7523429B2 patent drawing

AI summary

A system and method for integrated circuit design are disclosed to enhance manufacturability of circuit layouts through generation of hierarchical design rules which capture localized layout requirements. In contrast to conventional techniques which apply global design rules, the disclosed IC design system and method partition the original design layout into a desired level of granularity based on specified layout and integrated circuit properties. At that localized level, the design rules are adjusted appropriately to capture the critical aspects from a manufacturability standpoint. These adjusted design rules are then used to perform localized layout manipulation and mask data conversion.