IC Layout Compaction Within Design Rule Margins
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Solution Overview
Problem
Conventional IC fabrication methods do not allow for modifying layouts that are non-compliant or nearly non-compliant with design rules, limiting opportunities for further compaction and increasing surface area requirements.
Innovation Solution
A method to identify structures in IC layouts that exceed design rules by a threshold amount, allowing for modifications that maintain compliance with design rules, thereby reducing surface area and improving structure density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional processing techniques are used to ensure design rule compliance, then manufacturing reliability is maintained, but layout compaction opportunities are lost and surface area increases
Solution Approach 1:
The system performs preliminary analysis of design rules to identify structures that exceed rules by more than a threshold amount, allowing for proactive layout modifications before manufacturing. This preliminary identification enables compaction opportunities to be captured while maintaining compliance through controlled modifications.
Solution Approach 2:
The system modifies physical parameters of identified structures (such as spacing, size, or position) to reduce the excess compliance margin. By changing these parameters within controlled limits, the layout achieves better compaction while remaining compliant with design rules, thus reducing surface area without sacrificing manufacturing reliability.
2Reliability
If design rules are strictly enforced without modification, then manufacturing compliance is ensured, but structure density is reduced
Solution Approach 1:
The system applies different treatment to different structures based on their individual compliance characteristics. Structures exceeding design rules by more than the threshold are identified for modification, while others remain unchanged. This localized approach allows selective optimization of structure density in specific regions without compromising overall design rule compliance.
Solution Approach 2:
Physical parameters of selected structures are modified to increase structure density while maintaining compliance. The system adjusts parameters such as structure spacing, size, or positioning to maximize the number of structures per unit area, thereby increasing quantity of substance without violating design rules.
3Productivity
If layout modifications are made to reduce surface area, then manufacturing efficiency improves, but risk of design rule violations increases
Solution Approach 1:
The system performs preliminary identification of structures exceeding design rules by significant margins, creating a controlled set of candidates for modification. This preliminary filtering ensures that only structures with sufficient compliance margin are modified, pre-assessing the risk before actual layout changes are made.
Solution Approach 2:
The system implements a feedback mechanism where layout modifications are made and then verified for compliance with design rules. This closed-loop approach allows the system to detect and correct potential violations, ensuring that productivity improvements do not come at the cost of compliance reliability.
Data Source
AI summary
The disclosure provides a method for modifying integrated circuit (IC) layouts in compliance with design rules. Methods of the disclosure include identifying, within an integrated circuit (IC) layout, a structure having a physical parameter compliant with a design rule for the layout and exceeding the design rule by a threshold amount. The method includes determining whether modifying the physical parameter for the structure to be less than the threshold amount maintains compliance with the design rule. In response to determining that modifying the physical parameter maintains compliance with the design rule, the method includes modifying the IC layout and transmitting the modified IC layout to a manufacturing device.