Automated Thermal Analysis of IC Layout Data
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Solution Overview
Problem
The existing methods for conducting thermal analysis of integrated circuit devices are cumbersome and time-consuming, prone to human error, and require significant manual interaction or data cleanup from intermediate format files, making them inefficient for timely and accurate analysis.
Innovation Solution
An automated thermal analysis system that uses a data conversion program to parse integrated circuit layout data, generate thermal source areas, and instruct a finite element analysis program to create a three-dimensional mesh, allowing for minimal user interaction and efficient thermal analysis by performing Boolean operations and collecting operating condition information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual entry of coordinate pairs is used to define driver areas, then the finite element analysis can be performed, but the likelihood of human error increases and the process becomes time-consuming
Solution Approach 1:
The patent uses IGES files as intermediate representations that copy the driver area definitions from the layout tool into a format that the finite element analysis tool can process. This eliminates the need for manual coordinate entry while maintaining accuracy through automated data transfer.
Solution Approach 2:
The patent introduces an intermediate format (IGES files) as a mediator between the layout tool and the finite element analysis tool. This intermediate representation standardizes the data exchange, reducing human error and time requirements compared to direct manual entry or ad-hoc data conversion.
2Adaptability or versatility
If reading intermediate format files is used to import layout data, then data can be transferred between tools, but a considerable amount of time is required for data cleanup
Solution Approach 1:
The patent performs preliminary data conversion by automatically parsing the IGES file and pre-processing the driver area definitions before they are used in the finite element analysis. This preliminary action eliminates the need for manual data cleanup and reduces the overall time required for data transfer.
Solution Approach 2:
The patent implements automated parsing and processing of the intermediate format data, allowing the system to self-service the data conversion process without requiring manual intervention for cleanup or validation. This automation significantly reduces the time investment required for data exchange.
3Productivity
If automated data conversion is implemented, then the likelihood of human error is reduced and analysis time is minimized, but the complexity of the data conversion process increases
Solution Approach 1:
The patent uses the IGES file format as a universal intermediate representation that can handle various driver area configurations and layout styles. This universal format simplifies the data conversion process by providing a standardized interface between different tools, reducing the complexity that would otherwise arise from handling multiple proprietary formats.
Data Source
AI summary
The present invention includes a method for performing a thermal analysis, including the steps of determining size and placement of each of a plurality of drivers on an integrated circuit device. The determined size and placement of each driver is stored as layout data and the layout data is converted into input for a finite element analysis program. The input is applied to the finite element analysis program, and the finite element analysis program is used to construct a finite element mesh of the integrated circuit device from the input. Additionally, material properties are assigned to the finite element mesh, and a thermal analysis is performed of the finite element mesh to generate data in a thermal analysis report.