Integrated Circuit Layout Structure with Version Control Circuit
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Solution Overview
Problem
In the fabrication of complex integrated circuits, frequent revisions often require changing multiple metal layers, leading to increased costs and the need to record version numbers, which can result in excessive mask changes and higher development costs.
Innovation Solution
A layout structure and version control circuit that utilizes a signal-supplying unit and transfer cells with interconnected metal layers to minimize mask changes by allowing signal conversion between metal layers, reducing the number of masks needed for revisions and version number updates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple metal layers are changed during circuit revision, then circuit functionality can be updated, but the number of masks required increases leading to higher costs
Solution Approach 1:
The transfer cell is designed with multiple metal layers (first metal layer, second metal layer, third metal layer) that can universally transfer signals in different directions. The same transfer cell structure can handle horizontal signals, vertical signals, or bidirectional signals by configuring different metal layer connections, eliminating the need for separate dedicated paths for each signal direction and reducing the number of masks required during revisions.
Solution Approach 2:
The transfer cell employs dynamic signal routing where the first signal and second signal can be selectively transferred based on circuit requirements. The metal layers are configured to dynamically switch between transferring signals in different directions (horizontal or vertical) by controlling which metal layer receives and outputs the signal, allowing flexible circuit revision without excessive mask changes.
2Loss of information
If version number recording is implemented in the chip, then version tracking is achieved, but layout modification requires additional mask changes increasing costs
Solution Approach 1:
The version number recording function is merged with the existing transfer cell structure and metal layer routing. The version information is integrated into the signal routing paths using the same metal layers (first, second, and third metal layers) that are already present for signal transfer, rather than requiring separate dedicated routing layers. This merging approach allows version tracking to be implemented without adding excessive mask changes.
3Ease of manufacture
If routing follows standard rules with wires in odd layers routed vertically and even layers horizontally, then routing organization is maintained, but corner changes require three mask layers to be changed
Solution Approach 1:
The invention introduces an additional dimension to the routing structure by utilizing multiple metal layers (first, second, and third metal layers) with different orientations. Instead of being constrained to a single plane with fixed vertical/horizontal routing rules, the design uses stacked metal layers that can accommodate signal transfers in different directions without requiring changes to all three mask layers at corners. The third metal layer provides an additional routing dimension that simplifies corner connections.
Data Source
AI summary
The present invention relates to a layout structure and a version control circuit for integrated circuits. The layout structure for integrated circuits according to the present invention comprises a signal-supplying unit and at least a transfer cell. The signal-supplying unit is used for supplying a first signal and a second signal. The transfer cell has a plurality of metal layers interconnected. One of metal layers receives and transfers the first signal or the second signal. When changing the transfer cell to transfer the second signal instead of the first signal, the metal layers interrupt transferring the first signal but receive and output the second signal. When the circuit is revised and multiple sub-circuits as well as the transferred signal are changed, the fewest metal layers commonly adopted are used. Accordingly, the present invention can reduce effectively the number of masks, and thus reducing costs.