IC Module Coil Layout for Higher Impedance and Chip Mounting Strength
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Solution Overview
Problem
In IC modules, the decrease in fixing strength between the module substrate and the IC chip due to the IC chip being mounted on the connection coil, combined with the need for downsizing and the use of low capacitance IC chips, leads to challenges in increasing the impedance of the connection coil, which is further exacerbated by the risk of coil breakage and short-circuiting.
Innovation Solution
The IC module design includes a rectangular substrate with a spiral connection coil, an outermost connection terminal portion with a through-hole, and a land portion surrounding it, positioned to enhance impedance, along with specific coil width and terminal configurations to bypass and overlap with connection pads, ensuring a robust connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the IC chip is mounted on the substrate in a state of being located on the connection coil, then the fixing strength between the module substrate and the IC chip decreases, but increasing the distance between the IC chip and the connection coil is necessary to prevent improper mounting
Solution Approach 1:
The patent introduces an outermost connection terminal portion as an intermediary element between the IC chip and the connection coil. This terminal portion includes an outermost through-hole portion and an outermost land portion that provides a dedicated mounting area for the IC chip, allowing the chip to be mounted at a distance from the connection coil while maintaining proper fixing strength through the substrate's through-hole structure.
2Reliability
If the number of turns of the connection coil is increased to increase impedance, then the coil width must be reduced, but reducing the coil width increases the risk of coil breakage
Solution Approach 1:
The patent applies local quality by creating an outermost connection terminal portion with distinct structural characteristics (outermost through-hole portion and outermost land portion) at a specific location of the substrate. This localized structural enhancement provides improved mechanical support and electrical connection at the critical outermost region where the IC chip mounts, without requiring changes to the overall connection coil design or reducing coil width elsewhere.
3Reliability
If the interval between the turns of the connection coil is reduced to increase the number of turns, then the inductance increases, but the turn portions may short-circuit with each other
Solution Approach 1:
The outermost connection terminal portion serves as an intermediary structure that separates the IC chip mounting area from the connection coil. The outermost land portion provides a dedicated electrical connection area that prevents direct contact between the IC chip and the connection coil, eliminating the short-circuit risk while allowing the connection coil to maintain its optimal turn interval for achieving the required impedance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the impedance of the connection coil, addressing the challenges of coil breakage and short-circuiting while maintaining the necessary electrical connectivity and communication capabilities.
Implementation Method 1
a connection coil formed into a spiral form... the inductance of the connection coil is difficult to increase, and so is the impedance of the connection coil
Implementation Method 2
an antenna sheet including a coupling coil electromagnetically coupling with the connection coil in a contactless manner
Data Source
AI summary
An IC module according to the present invention includes a rectangular substrate having long sides extending in a first direction; a connection coil formed in a spiral shape on a first surface of the substrate; an outermost connection terminal portion formed at an outermost end of the connection coil; and an IC chip provided on a portion of the first surface on an inner peripheral side relative to the connection coil, wherein the outermost connection terminal portion includes an outermost through-hole portion penetrating the substrate in a thickness direction of the substrate, and an outermost land portion surrounding the outermost through-hole portion and connecting between the outermost through-hole portion and the connection coil; and as viewed in a second direction perpendicular to both the first direction and the thickness direction, the outermost connection terminal portion is disposed on a first side in the first direction relative to the IC chip.