IC Module with Dual Contact Pads for Pressure-Form and Soldered Connections
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Solution Overview
Problem
Existing IC modules for chip cards are limited to specific connection technologies, such as pressure-form connections, and are not suitable for soldered connections, restricting their application and increasing manufacturing costs.
Innovation Solution
The IC module is designed with optimized contact pads for pressure-form connections and additional solder terminals, allowing for both pressure-form and soldered connections, thereby expanding the connection reliability and versatility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the module is designed with contact pads optimized for pressure-form connections only, then the connection reliability for pressure-form connections is improved, but the module cannot be used for soldered connections
Solution Approach 1:
The module is designed with dual functionality by incorporating both pressure-form contact pads and solder terminals on the same contact area. This allows the module to be universally compatible with both pressure-form connection technology and soldered connection technology, eliminating the need for different module designs for different connection types.
Solution Approach 2:
The contact area is segmented into different functional zones: some areas are optimized for pressure-form connections with conductive adhesive, while other areas provide solder terminals for wire connections. This segmentation allows each connection type to have its own optimized contact region while sharing the same module structure.
2Adaptability or versatility
If additional solder terminals are added to the module, then the versatility for different connection technologies is improved, but the device complexity increases
Solution Approach 1:
The pressure-form contact pads and solder terminals are merged into a single integrated contact structure. The same contact pad area serves dual purposes: it can receive conductive adhesive for pressure-form connections or provide exposed terminals for soldering, thereby reducing overall device complexity while maintaining versatility.
Solution Approach 2:
The contact pads are designed to perform multiple functions: they serve as both pressure-form connection interfaces and solder terminals. This multi-functionality eliminates the need for separate structures for each connection type, thereby reducing device complexity while improving adaptability.
3Reliability
If different modules are supplied for different data-carrier types, then the connection reliability for each specific type is optimized, but the manufacturing costs increase
Solution Approach 1:
A single universal module design is supplied that can be used for all data-carrier types regardless of whether they use pressure-form connections or soldered connections. This universality simplifies manufacturing logistics, reduces inventory complexity, and lowers overall manufacturing costs while maintaining connection reliability through optimized contact design.
Solution Approach 2:
The module design accommodates different connection technologies by changing the parameters of the contact pads: the same physical structure can be configured to optimize for pressure-form connections or soldered connections depending on the application, allowing a single module type to serve multiple purposes effectively.
Data Source
AI summary
An IC module for installation in a portable data carrier and for electrical connection with an electronic device located in the data carrier supports at least two different connection technologies. It carries for this purpose contacting elements having a first set of contacting pads for a first connection technology and a second set of contacting solder areas for a second connection technology. A contacting pad of the first set of contacting pads in each case is connected electroconductively to a contacting pad of the second set of contacting pads. The connection can preferably be electively effected by a pressure-form technology or by means of connection wires as a soldered connection.