IC Module Structure for Fingerprint Sensor Card Connections

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Solution Overview

Problem

Hybrid IC cards with integrated fingerprint sensors and IC chips face increased production costs and complexity due to the need for separate wiring connections, which are prone to failure from bending, leading to communication issues.

Innovation Solution

An IC module design with a substrate through hole connecting a contact terminal to an IC chip and a fingerprint sensor via a holding portion, using conductive materials and different melting point solders for fixation, integrated with a booster antenna for contactless communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a fingerprint sensor is provided separately from the IC module, then fingerprint authentication function is added, but the number of production steps and production costs increase

Engineering Contradiction:

Improvefingerprint authentication functionVSAvoidproduction steps and production costs

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent integrates the fingerprint sensor and IC chip into a single IC module assembly, where the fingerprint sensor is mounted on the same substrate as the IC chip. This merging eliminates the need for separate wiring mechanisms and reduces production steps while maintaining the fingerprint authentication function.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves multiple functions: it provides mechanical support for both the IC chip and fingerprint sensor, establishes electrical connections through through-holes, and acts as a mounting platform. This multi-functionality reduces the need for additional components and production steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If the IC chip and fingerprint sensor are mounted using anisotropic conductive film, then electrical connection is established, but the connection is prone to peeling when force is applied due to bending

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidpeeling from bending force

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a planar mounting approach to a three-dimensional structure where the fingerprint sensor is mounted on the substrate surface with elevated positioning. This dimensional change allows for better stress distribution and reduces the peeling effect when bending forces are applied to the card.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent uses a combination of mounting structures including recesses in the substrate and mechanical retention features that are built in during manufacturing. These features provide beforehand cushioning against bending forces, preventing peeling before it occurs during card usage.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If multiple terminals are connected using anisotropic conductive film, then electrical connection is achieved, but the complexity of connection structure increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidconnection structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple electrical connection functions into integrated mounting structures. The substrate's through-holes and conductive pathways provide both mechanical support and electrical connection simultaneously, reducing the need for separate connection components and simplifying the overall connection structure.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces production steps and costs while maintaining reliable electrical connections, preventing communication failures from bending, and enhancing security with biometric authentication.

Implementation Method 1

the contact terminal is electrically connected to the IC chip via the through hole

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the fingerprint sensor is electrically connected to the IC chip via the holding portion

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

a first fixing portion that fixes the holding portion to the substrate; and a second fixing portion that fixes the holding portion to the fingerprint sensor, wherein the first fixing portion and the second fixing portion are formed of solders having different melting points from each other

Methodology Applied

Scientific EffectSoldering: Soldering

Data Source

PatentEP4715666A1IC module and IC card

Publication Date: 2026.03.25 TOPPAN HOLDINGS INC

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AI summary

The present invention is an IC module (20) including: a substrate (21) having a through hole (26); a contact terminal (29) provided on a first surface (21f) of the substrate (21); an IC chip (22) provided on a second surface (21g) of the substrate (21); a holding portion (25) fixed to the substrate (21) and projecting from the substrate (21); and a fingerprint sensor (24) fixed to the holding portion (25), wherein the contact terminal (29) is electrically connected to the IC chip (22) via the through hole (26), and the fingerprint sensor (24) is electrically connected to the IC chip (22) via the holding portion (25).