Integrated Circuit with Multi-Edge Conductive Pads for Orientation Flexibility
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Solution Overview
Problem
Conventional integrated circuit packages require specific orientation for proper insertion, leading to increased manufacturing costs and potential device damage due to the need for multiple IC designs with different pin-out and power locations to accommodate various orientations.
Innovation Solution
A package design with conductive pads on opposite sides, allowing multiple ICs with the same layout to be oriented differently within the package, with conductive pads on one edge connected to corresponding conductors on the package, enabling flexible orientation and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional IC packages use a specific orientation for proper insertion, then proper contact element engagement is ensured, but manufacturing costs increase and device damage risk increases due to needing multiple IC designs
Solution Approach 1:
The patent applies asymmetry by providing conductive pads at multiple edges of the chip rather than following conventional symmetric pin arrangements. This asymmetric pad distribution enables the chip to be properly connected in multiple orientations, eliminating the need for orientation-specific designs and reducing manufacturing costs associated with creating multiple IC variants.
Solution Approach 2:
The patent implements universality by designing a single IC layout that can function in multiple orientations. The conductive pads are strategically positioned at different edges of the chip so that the same chip design can be properly connected regardless of how it is inserted into the package, making the IC universal across different orientations and eliminating the need for multiple specialized designs.
2Adaptability or versatility
If multiple IC designs with different pin-out and power locations are used to accommodate various orientations, then proper insertion is ensured, but manufacturing costs increase
Solution Approach 1:
The patent uses asymmetric placement of conductive pads at multiple chip edges to enable a single IC design to adapt to various insertion orientations. This asymmetric configuration allows the same pin-out and power locations to work correctly regardless of orientation, providing versatility without requiring multiple IC designs.
Solution Approach 2:
The patent creates a universal IC design where the same chip layout can serve multiple orientations. The conductive pads are positioned such that the identical IC design can be properly connected in different orientations, making the design universal and eliminating the need to manufacture multiple orientation-specific IC variants.
3Reliability
If additional steps are taken during package manufacturing to ensure proper IC insertion, then proper placement is ensured, but manufacturing costs increase
Solution Approach 1:
The patent implements self-service by designing the IC with conductive pads at multiple edges that automatically ensure proper connection regardless of insertion orientation. The IC design itself provides the orientation-adaptability feature, eliminating the need for additional manufacturing steps or complex package design modifications to ensure proper IC placement.
Data Source
AI summary
An improved integrated circuit (IC) layout is described that provides conductive pads on opposite sides of a substrate. The conductive pads provide for connectivity to the chip in different chip orientations. Accordingly, multiple chips having the same layout can be provided in a package, instead of providing each chip with a different layout. Since the same layout may be used for each chip, manufacturing costs are reduced.